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Method for manufacturing electronic component box

A technology of electronic components and conductive layers, which is applied in the field of manufacturing electronic component boxes, and can solve problems such as adhesion of fluff and foreign matter

Active Publication Date: 2019-08-06
尹势元
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, when the conductive layer is formed by using cloth, foreign matter such as fluff may be generated and adhered to the coating surface of the unit electronic component case

Method used

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  • Method for manufacturing electronic component box
  • Method for manufacturing electronic component box
  • Method for manufacturing electronic component box

Examples

Experimental program
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Embodiment Construction

[0041] Hereinafter, the inventive concept will be described in detail with reference to the accompanying drawings.

[0042] figure 1 is a plan view showing an electronic component box 10 according to the inventive concept, and figure 2 is along figure 1 A cross-sectional view taken along the line A-A.

[0043] According to the concept of the present invention, the electronic component box 10 includes a base layer 11 , a first antistatic layer 13 and a second antistatic layer 15 , a receiving groove 19 and a conductive layer 17 .

[0044] The base layer 11 is formed of a synthetic resin having a thickness of about 0.5 mm to 3 mm so that the electronic component case 10 has sufficient rigidity to maintain its shape. The base layer 11 can be made of any one of solvent-resistant resins such as polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET) and polycarbonate (PC) that are insoluble in organic solvents. or may be formed from any of soluble resins such a...

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PUM

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Abstract

A method of manufacturing an electronic component box includes the steps: forming a first antistatic layer and a second antistatic layer on an upper surface and a lower surface of a base layer including a fabric sheet, respectively; forming a plurality of receiving grooves in a matrix form by performing air pressure forming on the base layer, the first antistatic layer and the second antistatic layer; cutting the result of the fabric state with the receiving slots into a unit electronic component box with M*N receiving slots, wherein M and N are natural numbers; and forming a conductive layeron a cutting surface of the unit electronic component cartridge by automatically or manually contacting and rubbing between the cutting surface of the unit electronic component cartridge and a synthetic resin containing a conductor or a conductive polymer material by a contact friction member to electrically connect the first antistatic layer and the second antistatic layer to each other.

Description

[0001] Cross References to Related Applications [0002] Claiming Korean Patent Application No. 10-2018-0010885 filed with the Korean Intellectual Property Office on January 29, 2018, Korean Patent Application No. 10-2018-0015100 filed on February 7, 2018, under U.S.C. §119, and the priority of Korean Patent Application No. 10-2018-0026654 filed on March 3, 2018, the entire contents of which are hereby incorporated by reference. technical field [0003] Embodiments of the inventive concept described herein relate to methods of manufacturing electronic component magazines (magazines), and more particularly, to methods of manufacturing electronic component magazines that include trays or carrier tapes to package electronic components such as semiconductor devices. element. Background technique [0004] To package individual electronic components such as semiconductor devices, or electronic components formed by assembling mutually different electronic components in modules in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/673H05K9/00
CPCH01L21/67336H05K9/0067
Inventor 尹势元
Owner 尹势元