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Microprocessor non-uniform sampling heat distribution reconstruction method based on convolutional neural network

A convolutional neural network and non-uniform sampling technology, applied in image data processing, electrical digital data processing, instruments, etc., can solve problems such as hotspot temperature error and inability to realize temperature perception, and achieve the effect of accurate overall temperature distribution data

Pending Publication Date: 2019-08-16
NORTHWESTERN POLYTECHNICAL UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when the number of thermal sensors is limited, there are obvious errors in the hotspot temperature reconstructed by this method, and accurate temperature sensing cannot be achieved.

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  • Microprocessor non-uniform sampling heat distribution reconstruction method based on convolutional neural network
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  • Microprocessor non-uniform sampling heat distribution reconstruction method based on convolutional neural network

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Embodiment Construction

[0032] Now in conjunction with embodiment, accompanying drawing, the present invention will be further described:

[0033] The method of the present invention is a method for realizing accurate thermal distribution reconstruction combined with a network model: first, the production of the sample temperature data set is completed using infrared thermal measurement technology, and the workload selects the SPEC CPU2006 standard performance evaluation benchmark (including 12 sets of integer benchmarks and 17 sets of floating-point benchmarks); secondly, use the classification network to determine the category of the workload application; finally, use the corresponding reconstruction network to reconstruct the temperature distribution of the chip; therefore, a total of 30 network models need to be designed and trained ( Including 1 classification network and 29 reconstruction networks).

[0034] The present invention comprises the following steps:

[0035] Step 1: Use the oil-cool...

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Abstract

The invention relates to a microprocessor non-uniform sampling heat distribution reconstruction method based on a convolutional neural network. The method comprises the following steps: firstly, manufacturing a sample temperature data set by using an oil cooling heat dissipation system capable of transmitting infrared spectrum; secondly, completing model training in a chip design stage or a silicon post-stage, and storing the trained network; thirdly, in the running stage of the processor, judging the category of the workload application program by using a classification network according to the temperature data sampled by the thermal sensor; and finally, obtaining the overall temperature distribution of the chip by using the corresponding heat distribution reconstruction network. Due to the fact that the workload classification network model and the heat distribution reconstruction network model are designed respectively, heat distribution reconstruction is carried out through the non-uniform temperature data sampled by the limited number of heat sensors, and the overall temperature distribution data of the chip obtained through recovery are more accurate.

Description

technical field [0001] The invention belongs to the technical field of chip temperature monitoring, and in particular relates to a method for reconstructing non-uniform sampling heat distribution of a microprocessor based on a convolutional neural network. First, use the oil-cooled heat dissipation system that can transmit the infrared spectrum to complete the production of the sample temperature data set; second, complete the model training in the chip design or post-silicon stage, and store the trained network; third, in the processor running stage, according to The thermal sensor samples the temperature data, and uses the classification network to judge the category of the workload application; finally, uses the corresponding thermal distribution reconstruction network to obtain the overall temperature distribution of the chip. Background technique [0002] In recent years, high-performance multi-core processors generally integrate on-chip thermal sensors to implement con...

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Application Information

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IPC IPC(8): G06F11/30G06T7/00
CPCG06T7/0004G06F11/3058G06F11/3089G06T2207/10048G06T2207/30148G06T2207/20081G06T2207/20084Y02D10/00
Inventor 李鑫欧兴涛李智周巍段哲民
Owner NORTHWESTERN POLYTECHNICAL UNIV