Load sensing devices, packages, and systems

Abstract

The embodiments of the disclosure relate to load sensing devices, packages, and systems. In an embodiment of the present invention, a load sensor package includes a housing having a cap, a column, a peripheral structure, and a base. The base includes a major surface configured to mount a stress sensor, while the cap includes a cap major surface configured to receive a load to be measured. The column is configured to transfer a predetermined fraction of the load to be measured to the base through the stress sensor. The peripheral structure is configured to transfer the remaining fraction of theload to be measured to the base.

Description

technical field [0001] The present disclosure relates to sensing devices and, in particular embodiments, load sensing devices, packages and systems. Background technique [0002] Conventional load sensors utilize strain gauges with metal resistors, such as conductive foils, that change resistance due to an applied load. Alternative thin metal films have also been used as sensing elements. Conventional commercial silicon strain and stress sensors exploit the planar piezoresistive effect of p-type silicon and n-type silicon, and also require complex designs at the sensor or package level to convert the applied load into planar strain or stress. [0003] Additionally, in such conventional designs, higher load applications require larger load cells, which increases manufacturing costs and makes the product too expensive for many applications. [0004] A second disadvantage of conventional load cells arises from changes in sensitivity due to environmental influences. For examp...

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Problems solved by technology

[0003] Also, in this conventional design, higher load applications require larger load cells, which increases manufacturing costs and makes the product too expensive for many applications

[0004] A second disadvantage of conventional load cells is the change in sensitivity due to environmental influences

For example, conventional load sensors can be stressed due to changes in the mechanical properties of the interposer in direct contact, changes in boundary conditions, and mismatches between the coefficients of thermal expansion of the sensing element, package, and die attach materials. while introducing errors in the sensing

In addition, low-cost sensors use nonlinear materials such as rubber and gel that change nonlinearly with respect to the external environment, introducing significant errors

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