Touch device and manufacturing method thereof
A technology for touch devices and touch electrodes, which is applied in the fields of instruments, computing, and electrical digital data processing, etc., and can solve the problems of nano-silver wire copper etching solution attack, poor interface adhesion, copper-silver symbiotic crystals, etc.
Active Publication Date: 2019-08-23
INTERFACE TECH CHENGDU CO LTD +2
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Problems solved by technology
However, when the wiring material is etched during the manufacturing process, if the wiring material is copper, and the copper is in direct contact with the nano-silver wire, the selection ratio of the etching solution for copper and nano-silver wire is quite low, so the nano-silver wire is vulnerable to copper etchant attack
In addition, after etching, the etchant remaining on the copper-silver interface is likely to cause copper-silver co-growth crystals, resulting in a short circuit
Furthermore, the interface adhesion between copper and silver nanowires is not good
Method used
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[0035] In order to make the description of the present disclosure more detailed and complete, the following provides an illustrative description of the implementation aspects and specific embodiments of the present invention; but this is not the only form of implementing or using the specific embodiments of the present invention. The various embodiments disclosed below can be combined or replaced with each other when beneficial, and other embodiments can also be added to one embodiment, without further description or illustration.
[0036] In the following description, numerous specific details will be set forth in order to enable readers to fully understand the following embodiments. However, embodiments of the invention may be practiced without these specific details. In other instances, well-known structures and devices are only schematically shown in order to simplify the drawings.
[0037] An aspect of the present invention is to provide a touch device and a manufacturin...
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The invention provides a touch device and a manufacturing method thereof. The touch device comprises a substrate, a touch electrode layer, a protective layer and a plurality of wires. The substrate comprises a first area and a second area, and the second area is adjacent to the first area. The touch electrode layer is arranged on the first area. The protective layer covers the touch electrode layer on the first area. The protective layer is provided with a plurality of openings. The openings expose a portion of the touch electrode layer and extend from the first region to the second region. Each of the conductive lines is formed in a corresponding opening and extends from the portion of the touch electrode layer to the second region, wherein each of the conductive lines does not fill eachof the openings and defines a recess in each of the openings. The touch device can avoid the problem of wiring short circuit.
Description
technical field [0001] The invention relates to a touch device and a manufacturing method thereof. Background technique [0002] At present, silver nanowires have been widely used as electrode materials for touch devices. However, when the wiring material is etched during the manufacturing process, if the wiring material is copper, and the copper is in direct contact with the nano-silver wire, the selection ratio of the etching solution for copper and nano-silver wire is quite low, so the nano-silver wire is vulnerable to copper Etchant attack. In addition, after etching, the etchant remaining on the copper-silver interface is likely to cause copper-silver co-growth crystals, thereby causing a short circuit in the wiring. Furthermore, the interface adhesion between copper and silver nanowires is not good. Therefore, a new design is currently needed to solve the above problems. Contents of the invention [0003] An aspect of the present invention provides a touch device...
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IPC IPC(8): G06F3/041
CPCG06F3/041G06F2203/04103G06F3/0443G06F3/04164
Inventor 王进立洪裕民叶颖隆
Owner INTERFACE TECH CHENGDU CO LTD