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Polishing material and method for manufacturing polishing material

A manufacturing method and a technology for grinding layers, which are used in the manufacture of tools, abrasives, and metal processing equipment, etc., can solve the problems of reduced grinding rate, scratches on the grinding body, and decreased surface pressure, so as to suppress the reduction of grinding rate and increase the thickness of the grinding part. Effect

Active Publication Date: 2019-08-27
BANDO CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the width of the groove is widened, the object to be polished will easily fall into the groove, so there is a risk of scratches on the object to be polished
Therefore, when increasing the area of ​​the polishing part, it is difficult to reduce the area occupancy, so there is a possibility that the surface pressure during polishing will decrease and the polishing rate will decrease.

Method used

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  • Polishing material and method for manufacturing polishing material
  • Polishing material and method for manufacturing polishing material
  • Polishing material and method for manufacturing polishing material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0099] The present invention is not limited to the above-mentioned embodiments, and can be implemented in various modified and improved modes other than the above-mentioned modes.

[0100] In the above-mentioned embodiment, the case where the polishing part has a square pattern shape has been described, but the polishing part is not limited to the square pattern shape. That is, the plurality of polishing parts may have different shapes or be arranged irregularly. However, from the viewpoint of reducing the anisotropy of polishing, the polishing portion is preferably in a square pattern.

[0101] In the above-mentioned embodiment, the case where the polishing portion contains a filler has been described, but the filler is not an essential constituent element, and an abrasive having a polishing portion that does not contain a filler is also within the intent of the present invention.

[0102] In the above-mentioned embodiment, the case where the abrasive material has an adhesive layer...

Embodiment 1

[0110] The diamond abrasive grains ("SCMD-C12-22" from Sino Crystal Diamond Company, with an average particle size of 16μm) and alumina (Al 2 O 3 , Pacific Rundum (Pacific Rundum) Co., Ltd.’s "LA4000", average particle size 4μm), fumed silica (Aerosil’s "Aerosil 200"), and adhesives Epoxy resin ("JER828" of Mitsubishi Chemical Co., Ltd.) is mixed, and the content of diamond abrasive particles in the solid content is 3% by volume, the content of filler is 71% by volume, and the content of fumed silica is It was adjusted to 5 vol% to obtain a coating liquid.

[0111] A substrate (average thickness of 300 μm) mainly composed of polycarbonate as a heat-resistant resin was prepared as a substrate, and the surface of the substrate was coated by printing using the coating solution. As the printed pattern, a circle with a diameter of 6 mm in plan view (average area 28.27 mm 2 A mask made of fluororesin with an opening of) and an average thickness of 1000 μm. Furthermore, the openings ha...

Embodiment 2

[0115] Except for adjusting the coating amount so that the average thickness of the polishing portion became 300 μm, the polishing material of Example 2 was obtained in the same manner as in Example 1.

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Abstract

The purpose of the present invention is to provide a polishing material whereby a polishing part can be made thicker while a reduction in polishing rate is suppressed, and a method for manufacturing apolishing material. This polishing material (1) is provided with a substrate (10) and a polishing layer (20) that includes abrasive grains (21) and a binder (22) and is layered on the surface side ofthe substrate (10), the polishing layer (20) having a plurality of columnar polishing parts (20a), the polishing parts (20a) including fumed silica, and the substrate (10) having a heat-resistant resin as a main component thereof.

Description

Technical field [0001] The invention relates to an abrasive material and a manufacturing method of the abrasive material. Background technique [0002] For example, in the processing of glass substrates used in electronic devices such as hard disks, abrasive materials that fix abrasive grains are generally used. As such an abrasive material, an abrasive material composed of an abrasive layer containing abrasive grains and a binder in the surface area of ​​the base material is known. [0003] In the abrasive material with fixed abrasive grains, the polishing layer is composed of a plurality of polishing portions. By constituting the polishing layer with a plurality of polishing parts in this way, the occupation rate of the area in contact with the object to be polished is reduced, and the surface pressure during polishing is increased, so that a high polishing rate can be expressed. In addition, the grooves formed between the plurality of polishing portions can be used to discharg...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D11/00B24D3/00
CPCB24D3/00B24D11/00
Inventor 中根聡一郎岩永友树
Owner BANDO CHEM IND LTD
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