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Abrasive and method for producing abrasive

A technology of abrasive layer and abrasive grains, used in the manufacture of tools, abrasives, metal processing equipment, etc., can solve the problems of reduced grinding rate, surface pressure, easy to fall into the groove, etc. reduced effect

Active Publication Date: 2021-08-17
BANDO CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the width of the groove is widened, the object to be polished will easily fall into the groove, so there is a risk of scratches on the object to be polished
Therefore, when increasing the area of ​​the polishing part, it is difficult to reduce the area occupancy, so there is a possibility that the surface pressure during polishing will decrease and the polishing rate will decrease.

Method used

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  • Abrasive and method for producing abrasive
  • Abrasive and method for producing abrasive
  • Abrasive and method for producing abrasive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0114] The present invention is not limited to the embodiment, and various modifications and modifications can be implemented in the embodiment, in addition to the manner.

[0115] In the above embodiment, the case where the abrasive portion is a block pattern, but the abrasive portion is not limited to the block pattern. That is, the plurality of abrasive portions can also be different shapes or are arranged irregularly. However, the grinding portion is preferably a square pattern.

[0116] In the present embodiment, the case where the abrasive portion contains a filler, but the filler is not necessary to constitute a component, and the abrasive material having a film containing the filler is also within the intent of the invention.

[0117] In the above embodiment, the case where the abrasive material has a next layer, but the layer is not necessary to constitute a component, may be omitted. In the case where the abrasive material does not have a layer, the next layer attachment...

Embodiment 1

[0125] The "SINO CRYSTAL Diamond" "SINO Crystal Diamond", "SCMD-C12-22", an average particle size of 16 μm, as a filler (Al 2 O 3 , "LA4000", average particle size of Pacific Rundum Co., Ltd., averaged (Aerosil), "Aerosil 200"), as well as a binder Epoxy resin (JER828 "of Mitsubishi Chemical Co., Ltd.) was mixed, and the content of diamond grinding in solid composition became 3% by volume, and the content of the filler was 71% by volume, as well as the content of gas phase silica. 5% by volume is adjusted to obtain coating liquid.

[0126] Preparing a substrate (an average thickness of 300 μm) as a main component as a heat-resistant resin as a substrate, using the coating liquid on the surface of the substrate using printing. As the pattern of printing, a circular shape having a diameter of 6 mm is used in a surface of 44% in size (an average area of ​​28.27 mm). 2 The opening portion, a fluorine resin having a average thickness of 1000 μm. Furthermore, the opening is a square pat...

Embodiment 2

[0130] The amount of coating is adjusted in such a manner that the average thickness of the abrasive portion is 300 μm, and the abrasive material of Example 2 is obtained in the same manner as in Example 1.

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Abstract

An object of the present invention is to provide an abrasive and a method for producing an abrasive that can thicken a polishing portion while suppressing a reduction in a polishing rate. The abrasive material (1) of the present invention includes a substrate (10), and an abrasive layer (20) laminated on the surface side of the substrate (10) and containing abrasive grains (21) and a binder (22). The grinding material (1), the grinding layer (20) has a plurality of columnar grinding parts (20a), the grinding part (20a) contains fumed silica, and the base material (10) is made of heat-resistant resin main component.

Description

Technical field [0001] The present invention relates to a method of manufacturing abrasive materials and abrasive materials. Background technique [0002] For example, in the process of the glass substrate used in electronic devices such as hard disk (Hard Disk), a abrasive material for fixing particles is usually used. As such a abrasive material, it is known that a abrasive material constructed in the surface area layer of the substrate contains abrasive particles and the abrasive layer of the binder. [0003] In the abrasive material of the abrasive particles, the abrasive layer is composed of a plurality of abrasive portions. The abrasive layer is constituted so similar to the plurality of abrasive portions, which is lowered to the area of ​​the area of ​​the abrasive body, and the surface pressure of the grinding is increased, and thus the high abrasive rate can be exhibited. Further, the grinding bruises can be discharged using a groove formed between the plurality of abras...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D11/00B24D3/00
CPCB24D3/00B24D11/00
Inventor 中根聡一郎岩永友树
Owner BANDO CHEM IND LTD
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