A multifunctional pressure-sensitive adhesive structure

Abstract

The invention belongs to the technical field of bonding bodies, and is specifically a multifunctional pressure-sensitive adhesive structure; including a structure body; the structure body is composed of an acetate fiber layer, a conductive layer and an adhesive layer; an acetic acid layer is arranged above the conductive layer fiber layer, the bottom of the conductive layer is provided with an adhesive layer; the present invention can reduce the weight of the structure body by opening a group of No. 1 through holes and utilizing the No. 1 through holes; When using the No. 1 through hole, the wind can pass through directly to dissipate heat from the structure body, avoiding the effect of excessive temperature on the bonding effect of the adhesive layer, thereby improving the bonding effect of the structure.

Description

technical field [0001] The invention belongs to the technical field of bonding bodies, in particular to a multifunctional pressure-sensitive adhesive structure. Background technique [0002] Pressure-sensitive adhesive is the abbreviation of pressure-sensitive adhesive. It is a kind of adhesive that is sensitive to pressure. It is mainly used to prepare pressure-sensitive tape. Expressed peeling force) < cohesive force of the adhesive (the force between the pressure-sensitive adhesive molecules) < the adhesion force of the adhesive (the adhesion between the adhesive and the substrate), such a pressure-sensitive adhesive will not be used during use. There are phenomena such as degumming. [0003] There is a multifunctional pressure-sensitive adhesive structure in the prior art, which is mainly used to seal the EMI shielding room, the connection between the housing and the circuit in the electronic equipment, and winding the cable for shielding, providing a reliable gro...

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Problems solved by technology

[0003] There is a multifunctional pressure-sensitive adhesive structure in the prior art, which is mainly used to seal the EMI shielding room, the connection between the housing and the circuit in the electronic equipment, and winding the cable for shielding, providing a reliable grounding surface, and for the surface that cannot be welded Provide a place for electrical contact, but the structure has shortcomings. On the one hand, the structure is heavier than the structure made of light materials, which is not easy to use; on the other hand, because the structure is bonded On the line on the field site, it is not only easily affected by the light, but also because of the self-heating of the line transmission, the temperature at the bonding point of the structure is relatively high, and the structure is easy to fall off from the bonding point of the line, which affects the connection of the line; making the technical solution limited

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