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Patch component and manufacturing method thereof, and method for manufacturing four-electrode patch resistor

A technology of chip resistors and manufacturing methods, which is applied in the direction of resistor manufacturing, resistors, thin film resistors, etc., can solve the problems of manpower consumption, wiring difficulties, and low wiring efficiency, so as to improve efficiency, simplify wiring processes, and solve routing problems. line difficulty effect

Active Publication Date: 2019-08-30
SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides a chip component and its manufacturing method, and a manufacturing method of a four-electrode chip resistor to solve the problem that some wiring is difficult and does not allow additional board layers and cannot pass through holes during the existing PCB wiring. In the case of implementing the hidden line method, adjusting the circuit design or adjusting the wiring layout in a large area consumes manpower and the wiring efficiency is low.

Method used

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  • Patch component and manufacturing method thereof, and method for manufacturing four-electrode patch resistor
  • Patch component and manufacturing method thereof, and method for manufacturing four-electrode patch resistor
  • Patch component and manufacturing method thereof, and method for manufacturing four-electrode patch resistor

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Embodiment Construction

[0034] In order to clearly illustrate the technical features of this solution, the present invention will be described in detail below through specific implementation modes and in conjunction with the accompanying drawings. The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and / or letters in different instances. This repetition is for the purpose of simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. It should be noted that components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and processes are omitted herein to avoid unnecessarily limiting the...

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Abstract

The invention discloses a patch component and a manufacturing method thereof, and a method for manufacturing a four-electrode patch resistor. The patch component includes a component body and a zero ohmic patch resistor body fixedly connected with the component body, wherein pad wiring of the zero ohmic patch resistor body is perpendicular to pad wiring of the component body, and an insulating material is disposed between the component body and the zero ohmic wiring resistor body. The patch component is advantaged in that a bidirectional patch member having four electrodes is formed by fixingand insulatingly connecting the zero ohmic patch resistor to the top (or the bottom) of an original component body, the number of resistor layers and the directions are increased from design of resistors, a layer of wiring is equivalently added onto the top or bottom of a PCB, a problem of difficult wiring is effectively solved, the wiring process is simplified, and wiring efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of surface mount device design, in particular to a patch component and a manufacturing method thereof, and a manufacturing method of a four-electrode chip resistor. Background technique [0002] At present, the reliability and cost of circuit board design is an extremely important part in server power supply design and other server circuit designs. PCB (Printed Circuit Board, printed circuit board) design is related to the success or failure of the entire design. At present, the requirements for the board area and the number of layers in PCB design are becoming increasingly stringent, because the larger the PCB area and the more layers, the higher the cost of the entire PCB. [0003] Therefore, a large part of the layout (layout) engineer's energy is considered in the layout and routing. At present, the way to cross the component routing in the circuit routing is mainly to make jumper routing through 0 ohm r...

Claims

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Application Information

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IPC IPC(8): H01C7/00H01C13/02H01C17/08H01C17/30
CPCH01C7/006H01C13/02H01C17/08H01C17/30
Inventor 陈安张洪镇肖波李松磊
Owner SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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