38results about How to "Simplify the wiring process" patented technology

The invention provides an OLED (Organic Light Emitting Diode) display mother board, a packaging system and a packaging method thereof, which belong to the technical field of organic light emitting diode displays, and can solve the problem that the sealing performance of the existing OLED display mother board is poor. The OLED display mother board comprises a packaging cover plate and an OLED substrate which are fit to each other, wherein adhesive sealant is arranged between the packaging cover plate and the OLED substrate, is arranged on the peripheral zone of the OLED display mother board, and adopts hot melt adhesive.

The invention provides a local interconnect structure for a CMOS image sensor and its manufacturing method. A self-aligned silicide (salicide) process is used to form a local interconnect for a CMOS image sensor consistent with a conventional CMOS image sensor process flow. An oxide layer is deposited over the pixel array of the image sensor. Portions of the oxide layer is removed and a metal layer is deposited. The metal layer is annealed to form a metal silicide. Optionally, a protective insulation layer is then deposited.

Disclosed are a three-dimensional flash memory device supporting a bulk erase operation and a manufacturing method therefor. A three-dimensional flash memory device supporting a bulk erase operation,according to one embodiment, may comprise: a string including a channel layer configured to extend in one direction and a plurality of electrode layers vertically stacked with respect to the channel layer; an upper wiring layer disposed on an upper portion of the string; at least one intermediate wiring layer which penetrates through the channel layer in an intermediate area of the string and is disposed between the plurality of electrode layers; a lower wiring layer disposed on a lower portion of the string; and at least one connection part formed in the at least one intermediate wiring layerso as to connect at least two channel layers divided by the at least one intermediate wiring layer. A three-dimensional flash memory device including a buried intermediate wiring layer, according toanother embodiment, may comprise: a string including a channel layer configured to extend in one direction; a channel connection part for connecting, in an intermediate area of the string, an upper channel layer and a lower channel layer of the string to each other; an intermediate wiring layer which can be selectively used as any one from among a source electrode and a drain electrode for the string; and a wiring connection part for connecting the channel connection part and the intermediate wiring layer to each other while at least a part thereof is buried in the string.

A three-dimensional flash memory including an intermediate wiring layer, and a manufacturing method therefor are disclosed. According to one embodiment, a method for manufacturing a three-dimensional flash memory by using a post process comprises the steps of: forming a lower string at a first block, which includes a sacrificial layer and an insulating layer that extend in a first direction so as to be alternately stacked; generating an inter-string insulating film in the upper region of the first block having the lower string; etching at least a part of the inter-string insulating film so as to form at least one sacrificial film in the space in which the at least a part of the inter-string insulating film is etched; generating, in the upper region of the inter-string insulating film having the at least one sacrificial film, a second block, which includes the sacrificial layer and the insulating layer that extend in the first direction so as to be alternately stacked; forming an upper string at the second block; etching the sacrificial layer included in the first block, the at least one sacrificial film, and the sacrificial layer included in the second block; and forming an electrode layer to be used as at least one intermediate wiring layer in the space in which the at least one sacrificial film is etched, and an electrode layer used as a word line in the space in which the sacrificial layer included in the first block is etched and in the space in which the sacrificial layer included in the second block is etched.

The invention provides a gelling-prevention heating device for a refrigerator. The refrigerator comprises a box body and a door body which is rotatably connected with the box body, wherein the heating device comprises a door rotating beam assembly vertically arranged on the door body; the interior of the door rotating beam assembly is a hollow chamber and a heater is arranged internally in the door rotating beam assembly; and the heater comprises an upper heater, a middle heater and a lower heater of which the power is sequentially and gradually increased from top to bottom. According to the gelling-prevention heating device disclosed by the invention, the gelling of the lower part of a refrigeration chamber can be effectively prevented, the heating time is shortened, and the energy consumption of refrigerator is reduced; moreover, line distribution process of the heater is comparatively simple, the operation is easy, and the security is high.

The invention discloses an automatic lead test device. The automatic lead test device comprises a foundation, an epoxy plate, a shielding cabinet, a withstand voltage tester, a conductive clamp, a wire rod tester, a controller and an on-off mechanism, wherein the on-off mechanism further comprises a bottom plate, a bearer, a handle, a clamping seat, a sliding seat, a terminal, a spring and a stroke switch. During test, two end connectors of a to-be-tested lead are arranged in the clamping seat, the conductive clamp clamps a lead insulation layer, the handle is pushed manually, the terminal fixedly connected with the sliding seat is pushed by an arc-shaped pushing head to move to the clamping seat portion to connect with the lead connectors, the wire rod tester is controlled by the controller for testing on and off of the lead, the handle is then pushed manually, the terminal is driven by the spring to reset, and the withstand voltage tester is controlled by the controller for carrying out withstand voltage test on the lead when the stroke switch is triggered by the handle. The automatic lead test device is advantaged in that the structure is simple, automatic lead withstand voltage test and conduction can be realized, the wiring technology is greatly simplified, labor intensity is reduced, and test efficiency is improved.