Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Two-dimensional array ultrasonic transducer based on three-dimensional ultrasonic imaging and its preparation method

An ultrasonic transducer and three-dimensional ultrasonic technology, applied in ultrasonic/sonic/infrasonic diagnosis, sonic diagnosis, infrasonic diagnosis, etc., can solve the problems of difficult to meet actual needs, complicated wiring process, high cost, and optimize the wiring technology of array elements. , The effect of solving the wiring process and reducing the preparation cost

Active Publication Date: 2018-07-17
THE HONG KONG POLYTECHNIC UNIV SHENZHEN RES INST
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a two-dimensional array ultrasonic transducer based on three-dimensional ultrasonic imaging, aiming to solve the problem of the complicated wiring process of the two-dimensional array ultrasonic transducer based on three-dimensional ultrasonic imaging in the prior art, resulting in high cost and difficult The problem of meeting actual needs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Two-dimensional array ultrasonic transducer based on three-dimensional ultrasonic imaging and its preparation method
  • Two-dimensional array ultrasonic transducer based on three-dimensional ultrasonic imaging and its preparation method
  • Two-dimensional array ultrasonic transducer based on three-dimensional ultrasonic imaging and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0020] The implementation of the present invention will be described in detail below in conjunction with specific embodiments.

[0021] like Figure 1~3 Shown is the preferred embodiment provided by the present invention.

[0022] The two-dimensional array ultrasonic transducer 1 provided in this embodiment is used in three-dimensional ultrasonic imaging technology, and includes an insulating resin frame 102 , a conductive backing plate 105 , a piezoelectric sheet 107 and a printed circuit board 101 .

[0023] Wherein, the insulating resin frame 102 is provided with NxN hollow passages, the hollo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of three-dimensional ultrasonic imaging and discloses a two-dimensional array ultrasonic transducer based on the three-dimensional ultrasonic imaging and a preparation method for the same. The two-dimensional array ultrasonic transducer comprises an insulated resin frame, an electric-conduction backer board, a piezoelectric plate and a printing circuit board, wherein N*N hollow channels filled with an electric-conduction adhesive are formed in the insulated resin frame; the electric-conduction backer board is disposed on the insulated resin frame; the piezoelectric plate is located on the electric-conduction backer board and comprises N*N piezoelectric array elements; and N*N array row pins which are correspondingly disposed in the N*N hollow channels respectively are disposed on the printing circuit board. By the electric-conduction adhesive, the piezoelectric array elements are electrically connected to the array row pins, so that the problem in complex wiring technologies of the array elements of the two-dimensional ultrasonic transducer is solved, and preparation cost is reduced. Meanwhile, the short-circuited problem happening when an interval between every two piezoelectric array elements is too small during wiring is avoided. In addition, the electric-conduction backer board can absorb useless sound waves on the back face of the piezoelectric plate, so that quality of the two-dimensional array ultrasonic transducer can be improved greatly.

Description

technical field [0001] The invention relates to the technical field of medical ultrasonic imaging, in particular to a two-dimensional array ultrasonic transducer based on three-dimensional ultrasonic imaging and a preparation method thereof. Background technique [0002] Real-time three-dimensional ultrasound imaging technology is one of the important means of medical imaging diagnosis today. This technology can improve the scanning frame rate and meet the high-quality imaging requirements. Compared with the traditional single-array element and one-dimensional array ultrasonic transducer, two The three-dimensional array phased array system is an effective means to solve the real-time three-dimensional imaging of ultrasound. It can focus in two directions, greatly improve the detection space resolution, and the data acquisition process is fast and stable. It does not need to move and rotate the ultrasonic transducer. Free deflection and focusing enable three-dimensional imagi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): A61B8/00
Inventor 戴吉岩方华靖黄智文陈燕
Owner THE HONG KONG POLYTECHNIC UNIV SHENZHEN RES INST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products