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OLED (Organic Light Emitting Diode) display mother board, packaging system and packaging method thereof

A packaging system and packaging method technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of OLED device pollution, UA glue puncture, and entering into the box, so as to achieve simple structure and improve production efficiency , cost-saving effect

Inactive Publication Date: 2015-05-20
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The inventors have found that there are at least the following problems in the prior art: before the peripheral area of ​​the cover glass is irradiated with UV lamps, due to the pressure difference between the UV glue in the box and the UV glue in the atmospheric environment, the UA glue here It is easy to be "punctured" so that the outside gas enters the box, and the glass frit is not cured at this time, resulting in contamination of the OLED device

Method used

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  • OLED (Organic Light Emitting Diode) display mother board, packaging system and packaging method thereof
  • OLED (Organic Light Emitting Diode) display mother board, packaging system and packaging method thereof
  • OLED (Organic Light Emitting Diode) display mother board, packaging system and packaging method thereof

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Embodiment 1

[0050] combine figure 1 and 2 As shown, this embodiment provides an OLED display motherboard, which includes an encapsulation cover 10 and an OLED substrate 20 facing each other, and a sealant is provided between the encapsulation cover 10 and the OLED substrate 20, so that The sealant is arranged on the peripheral area of ​​the OLED display motherboard, and the sealant adopts hot melt adhesive 11 .

[0051]Because in the peripheral area of ​​the OLED display motherboard of this embodiment, the hot melt adhesive 11 is used for sealing between the packaging cover plate 10 and the OLED substrate 20, and the hot melt adhesive 11 itself has better adhesion characteristics than UV adhesives. , the encapsulation cover plate 10 and the OLED substrate 20 can be well sealed, so particles and impurities in the external environment can be effectively prevented from entering the interior of the OLED display motherboard and polluting the devices in the OLED display motherboard, thereby ca...

Embodiment 2

[0056] combine image 3 and 4 As shown, the present embodiment provides a packaging system, including sealant wiring equipment, and the sealant wiring equipment includes: a first carrying machine 30 for carrying the packaging cover 10; a wiring mechanism 40 for hot-melting The glue 11 is routed to the peripheral area of ​​the package cover 10 .

[0057] In this embodiment, the packaging system includes a sealing glue wiring device. By wiring the hot melt glue 11 to the peripheral area of ​​the packaging cover 10 , the sealing is better when the packaging cover 10 and the OLED substrate 20 are aligned.

[0058] Wherein, the wiring mechanism 40 of this embodiment preferably includes a collection unit 43, a tray 41, a plurality of fixed posts 42 arranged on the tray 41, and a driver, the collection unit 43 is used to collect each of the fixed posts 42 and The positional relationship of the reference points on the packaging cover plate 10 to be wired; the driver is used to set e...

Embodiment 3

[0064] This embodiment provides a packaging method for packaging an OLED display motherboard. Wherein, the OLED display motherboard can be the OLED display motherboard described in Embodiment 1, and the packaging method can be applied to the packaging device of Embodiment 2, and the packaging method includes the following steps:

[0065] S01 , use hot melt adhesive 11 to perform wiring on the peripheral area of ​​the package cover 10 .

[0066] This step specifically includes: first placing the packaging cover plate 10 on the first carrying machine 30, determining the positions of the four reference points in the peripheral area of ​​the packaging cover plate 10, and determining the relationship between the four reference points and the hot melt adhesive 11 to be passed. The positional relationship of the wiring area, and use the hot melt adhesive 11 to perform wiring in the peripheral area of ​​the package cover 10; then heat the area where the four reference points of the pa...

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Abstract

The invention provides an OLED (Organic Light Emitting Diode) display mother board, a packaging system and a packaging method thereof, which belong to the technical field of organic light emitting diode displays, and can solve the problem that the sealing performance of the existing OLED display mother board is poor. The OLED display mother board comprises a packaging cover plate and an OLED substrate which are fit to each other, wherein adhesive sealant is arranged between the packaging cover plate and the OLED substrate, is arranged on the peripheral zone of the OLED display mother board, and adopts hot melt adhesive.

Description

technical field [0001] The invention belongs to the technical field of organic electroluminescence display, and in particular relates to an OLED display motherboard, a packaging system and a packaging method thereof. Background technique [0002] Organic light-emitting display (Organic Light-Emitting Diode; OLED) device, as a new type of flat-panel display, has received a lot of attention due to its characteristics of active light emission, high luminous brightness, wide viewing angle, fast response speed, low energy consumption and flexibility. More and more attention has become the next generation display technology that may replace liquid crystal display. [0003] Organic layer materials that are extremely sensitive to water vapor and oxygen exist in current OLED devices, which greatly reduces the lifetime of OLED devices. In order to solve this problem, in the prior art, various materials are mainly used to isolate the organic layer material of the OLED from the outside...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56H01L27/32H10K99/00
CPCH10K59/12H10K59/8722H10K71/40H10K71/50H10K50/8426H10K71/00H01L21/67092H01L21/67103H01L21/67259
Inventor 白雪飞崔富毅杨久霞李发顺阮士薪肖昂
Owner BOE TECH GRP CO LTD
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