Three-dimensional flash memory device supporting bulk erase operation and manufacturing method therefor
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SAMSUNG ELECTRONICS CO LTD
- Publication Date
- 2021-01-08
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Abstract
Description
technical field
[0001] The present disclosure relates to a three-dimensional flash memory device and a method for manufacturing the three-dimensional flash memory device, in particular to a three-dimensional flash memory device with a structure supporting a bulk erase operation. Background technique
[0002] Flash memory devices are electrically erasable programmable read-only memory (EEPROM), and thus are commonly used in, for example, computers, digital cameras, MP3 players, game systems, memory sticks, and the like. Such a flash memory device controls input and output of data through Fowler-Nordheim tunneling (F-N tunneling) or hot electron injection.
[0003] Specifically, refer to figure 1 , figure 1 An existing three-dimensional flash memory array is shown, and the existing three-dimensional flash memory array may include a common source line CSL, a bit line BL, and a plurality of cell strings CSTR between the common source line CSL and the bit line BL.
[0004] Bit...