Local interconnect structure and method for a cmos image sensor
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- OMNIVISION TECH INC
- Publication Date
- 2006-06-14
Smart Images
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Abstract
Description
Technical field
[0001] The present invention relates to an image sensor, and more specifically, the present invention relates to an image sensor including a local interconnect structure. Background technique
[0002] Image sensors have become ubiquitous, and they are widely used in digital cameras, portable phones, security cameras, medical equipment, automobiles, and other applications. The technology for manufacturing image sensors, especially CMOS (Complementary Metal Oxide Semiconductor) image sensors, continues to develop rapidly. For example, the requirements for high resolution and low energy consumption have promoted further miniaturization and integration of image sensors. Therefore, the number of pixels in the pixel array of the image sensor has increased significantly.
[0003] For example, a 5-megapixel CMOS sensor is currently being manufactured. This large pixel array means that a large amount of data can be collected and read. In addition, the speed of obtaining an...