Method for processing workpiece
A technology of processed objects and processing methods, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as difficult to remove, and achieve the effect of preventing adhesion to the side of the chip
Pending Publication Date: 2019-09-06
DISCO CORP
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Problems solved by technology
[0005] However, gaps are formed between the divided chips, so when the chip is divided and then ground to the finished thickness, grinding water containing grinding shavings will infiltrate into the gap between the chips and the grinding shavings will adhere to the chip side.
Grinding debris adhering to the side of the chip is very difficult to remove even if it is cleaned by the cleaning mechanism of the grinding device
Method used
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[0016] figure 1 The illustrated workpiece W has a circular plate-shaped substrate, and on the front surface Wa of the substrate, functional elements are respectively formed in regions divided by a plurality of planned dividing lines S formed in a grid pattern (in the figure). In the example device D). The rear surface Wb on the opposite side to the front surface Wa of the workpiece W is a surface to be processed to be subjected to predetermined processing. The material, thickness, and size of the workpiece W are not particularly limited. Hereinafter, a processing method of dividing the workpiece W into individual chips along the planned dividing line S will be described.
[0017] (1) Front protection steps
[0018] Such as figure 1 As shown, the area where the device D is formed on the front surface Wa of the workpiece W is covered with the front protection member 1 . The front protection member 1 shown in this embodiment has adhesiveness and has substantially the same di...
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Provided is a method for processing a workpiece, which forms the workpiece to a finished thickness and ensures that grinding water containing grinding chips does not penetrate into a gap between adjacent chips. The method for processing a workpiece includes: a front surface protection step of covering a front surface (Wa) of a workpiece (W) with a front surface protection member (1); a protectivemember heating step of hardening and shrinking the adhesive material of the front protective member; a modified layer formation step for forming a modified layer (M) inside the workpiece; a back surface grinding step of grinding the back surface (Wb) of the workpiece to form a finished thickness of the chip; and a protective component extension step, an object to be processed is divided into individual chips (C), and the intervals (7) between the chips are expanded. By hardening and shrinking the adhesive material of the front surface protective member in the protective member heating step, anundivided region in which the chips are not completely divided in the back surface grinding step is formed on the workpiece, and no gap is generated between the chips during back surface grinding, thereby preventing grinding chips from adhering to the side surfaces of the chips.
Description
technical field [0001] The present invention relates to a method for processing a workpiece. Background technique [0002] In the manufacturing process of a semiconductor device, a plurality of regions are divided into a plurality of regions on the front surface of a generally disc-shaped workpiece by dividing lines called streets arranged in a grid pattern, and in the divided regions are formed IC, LSI and other circuits (functional components). Then, the to-be-processed object is cut|disconnected along the division|segmentation plan line, and the area|region in which the circuit was formed is divided|segmented, and each chip is manufactured. [0003] As a method of cutting a workpiece along a line to be divided, there is a laser processing method in which a laser beam is irradiated with a pulsed laser beam that is transparent to the workpiece while converging a focus point inside a region to be divided. In the division method using this laser processing method, the focus...
Claims
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IPC IPC(8): H01L21/78
CPCH01L21/304H01L21/78H01L21/76H01L21/67132H01L21/6836H01L21/67092
Inventor 上里昌充
Owner DISCO CORP