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Test assembly and method for testing electrical components

A technology for testing components and components, which is applied to the components of electrical measuring instruments, measuring electricity, measuring electrical variables, etc., and can solve problems such as damage to transistor components

Active Publication Date: 2022-03-29
ISMECA SEMICONDUCTOR HOLDING SA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, typically in existing solutions the lid plate is moved too close to the base plate causing the second and third set of electrical contacts to penetrate too far into the gate and source, thereby damaging the transistor components

Method used

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  • Test assembly and method for testing electrical components
  • Test assembly and method for testing electrical components
  • Test assembly and method for testing electrical components

Examples

Experimental program
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Embodiment Construction

[0076] Referring to Figures la-c, there is shown a parts handling assembly 1 according to an embodiment of the invention. The assembly 1 comprises a rotatable turntable 3 with a plurality of component processing heads 5 ; each component processing head 5 can hold a respective component 10 by means of vacuum. In this example, component 10 is a transistor component 10 .

[0077] The assembly 1 comprises a plurality of stations 8 located at the periphery of the turntable 3 ; each station 8 is configured to perform testing (for example of electrical or mechanical characteristics of the components) or processing of components in some way.

[0078] The turntable 3 is iteratively rotated to transfer components between stations 8 . The component processing heads 5 may each be selectively extended from the turntable 3 towards a respective station 8 to transport the components 10 held by the processing heads 5 to the station 8 below for processing or testing; and when processing has be...

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PUM

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Abstract

The present invention provides a test assembly and corresponding method for testing electrical components. In particular, the present invention provides a test assembly and a corresponding method for testing the performance of transistor components under high current conditions, wherein the risk of damaging the transistor components under test is reduced.

Description

technical field [0001] The invention relates to a test assembly and a corresponding method for testing electrical components. In particular, the invention relates to a test assembly and a corresponding method for testing the performance of a transistor component under high current conditions, wherein the risk of damaging the transistor component under test is reduced. Background technique [0002] In test assemblies and methods for testing electrical components under high current conditions, typically a high current is supplied to the electrical component under test via a plurality of electrical contacts provided at the test station. The electrical component under test should be positioned at the test station such that it electrically contacts all of the plurality of electrical contacts simultaneously. [0003] For example, a component may be a transistor component having a gate, a source, and a drain. Typically, a test station for testing a transistor component will have ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R1/04
CPCG01R1/0466G01R31/2601G01R31/2642
Inventor D.查瓦伊拉兹D.科斯特M.奥伯利G.拉美尔P.施温登汉梅尔P.维弗格
Owner ISMECA SEMICONDUCTOR HOLDING SA