A dipping head for coating conductive adhesive
A technology of dipping glue head and conductive glue, applied in the coating, the device for coating liquid on the surface, etc., can solve the problems of insufficient glue overflow, short circuit of chip pads, difficult production standards, etc., to improve the coating of conductive glue. The effect of quality, improved production efficiency, and simple production procedures
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[0021] Attached below Figure 1-5 The technology will be further described with specific examples to help understand the content of the present invention.
[0022] This technology focuses on multi-chip high-density packaging, and the dipped bumps are at least two rows and two columns. In this embodiment, three rows and five columns are used as an example:
[0023] A dipping head for coating conductive adhesive, comprising a connecting shaft 1, a rotating body 6, a dipping head base 4, a dipping bump 2 and a dipping shrinkage bump 3, wherein the rotating body 6 is fixedly mounted on the connecting shaft 1, the bottom of the connecting shaft 1 is provided with a dipping head base 4, the dipping bump 2 and the dipping shrinkage bump 3 are arranged on the dipping head base 4, the dipping bump 2 and the dipping shrinkage bump 3 Arranged in a matrix, the dipping contraction bumps 3 are located on the outermost side of the dipping head base 4 and correspond to the positions of the c...
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