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Display module, display module manufacturing method and display device

A technology for display modules and display areas, applied in instruments, nonlinear optics, optics, etc.

Active Publication Date: 2019-09-27
SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Embodiments of the present invention provide a display module, a method for manufacturing the display module, and a liquid crystal display device, so as to solve the problem of the binding process of bridging flexible circuit boards existing in the narrow frame design in the prior art

Method used

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  • Display module, display module manufacturing method and display device
  • Display module, display module manufacturing method and display device
  • Display module, display module manufacturing method and display device

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Embodiment Construction

[0040] Certain terms are used, for example, in the description and claims to refer to particular components. Those skilled in the art should understand that hardware manufacturers may use different terms to refer to the same component. The specification and claims do not use the difference in name as a way to distinguish components, but use the difference in function of components as a criterion for distinguishing. As mentioned throughout the specification and claims, "comprising" is an open term, so it should be interpreted as "including but not limited to". "Approximately" means that within an acceptable error range, those skilled in the art can solve the technical problem within a certain error range and basically achieve the technical effect. The subsequent description of the specification is a preferred implementation mode for implementing the application, but the description is for the purpose of illustrating the general principle of the application, and is not intended...

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Abstract

The invention discloses a display module, a display module manufacturing method and a display device. The display module comprises a display panel, a transfer flexible circuit board, a driving module and a main flexible circuit board; the display panel is divided into a display area and a non-display area; the non-display area comprises a binding area; m rows of first bonding pads are arranged in the binding area; the transfer flexible circuit board comprises m first flexible circuit boards; a first flexible circuit board and a row of first bonding pads are correspondingly bound and electrically connected; m first flexible circuit boards are stacked in sequence along the direction vertical to the plane where the array substrate is; the driving module comprises a driving chip and a piece of COG glass; m rows of second bonding pads are arranged on the surface at the same side of the COG glass bound with the driving chip; and a first flexible circuit board and a row of second bonding pads are correspondingly bound and electrically connected. The reliability of the binding process of the transfer flexible circuit board can be ensured; and furthermore, the narrow frame design of the display module is easily realized.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a display module, a method for manufacturing the display module, and a display device. Background technique [0002] With the development of consumer electronic devices in terms of thinness, narrow bezels, high resolution, and high screen-to-body ratio, the size of the lower frame of the display module is required to be smaller and smaller, and the integrated circuit chip is bound to the glass (COG, Chip On Glass) ) is a technology used more in current display modules, but this kind of direct binding of integrated circuit chips (IC) on the glass of the display panel will occupy the non-display area of ​​the display panel, which is not conducive to the realization of narrow LCD panels. Border full screen design. In order to overcome this, the integrated circuit chip (IC) and the main flexible circuit board are first bound on the transfer glass, and then the signal is t...

Claims

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Application Information

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IPC IPC(8): G02F1/1362G02F1/1345
CPCG02F1/13452G02F1/13458G02F1/1362
Inventor 郭浩夏志强
Owner SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
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