Circuit module and method for manufacturing circuit module

Abstract

A circuit module (100) is provided with: a substrate (1), one main surface of which is provided with a first wiring pattern (2); first electronic components (3-6) that constitute a first electronic circuit with the first wiring pattern (2); a plurality of connecting conductive bodies (8); a plurality of external connection terminals; a first resin layer (9); and a second resin layer (12). At leastone of the connecting conductive bodies (8) includes: a first columnar conductive body (8a) extending in the normal line direction of the one main surface of the substrate (1); and a board-like conductive body (8b) extending in the direction parallel to the one main surface of the substrate (1). At least one of the external connection terminals is a second columnar conductive body (11) extendingin the normal line direction of the one main surface of the substrate (1). The cross-sectional area of the first columnar conductive body (8a), said cross-sectional area being orthogonal to the normalline direction of the one main surface of the substrate (1), is smaller than the cross-sectional area of the second columnar conductive body (11), said cross-sectional area being orthogonal to the normal line direction of the one main surface of the substrate (1).

Description

technical field [0001] This invention relates to a circuit module including a substrate, an electronic component connected to the substrate to form an electronic circuit, an external connection terminal, a connection conductor connecting the electronic circuit and the external connection terminal, and a resin layer. Background technique [0002] There is known a circuit module including a substrate, electronic components connected to the substrate to form an electronic circuit, metal posts connected to the substrate, and a resin layer. An example of such a circuit module includes a circuit module described in International Publication No. WO2013 / 035714 (Patent Document 1) (corresponding to Japanese Patent No. 5768888). [0003] Figure 6 It is a cross-sectional view of the circuit module 300 described in Patent Document 1. FIG. Such as Figure 6 As shown, the circuit module 300 has a substrate 301 , electronic components 303 to 305 constituting an electronic circuit, metal ...

AI Technical Summary

Problems solved by technology

Due to the above-mentioned requirements, in the structure of the circuit module 300 described in Patent Document 1, it is difficult to miniaturize

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