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A kind of polishing equipment and method

A technology of equipment and polishing head, which is applied in the direction of grinding/polishing equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as the inability to meet the quality requirements of silicon wafers, and achieve the goal of improving local flatness, reducing the number of residues, and reducing pollution Effect

Active Publication Date: 2021-06-22
XIAN ESWIN SILICON WAFER TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The embodiment of the present invention provides a polishing equipment and method to solve the problem that the existing polishing equipment and methods cannot meet the quality requirements of silicon wafers

Method used

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  • A kind of polishing equipment and method
  • A kind of polishing equipment and method
  • A kind of polishing equipment and method

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Embodiment Construction

[0039] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0040] The terms "first", "second" and the like in the description and claims of the present invention are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are, for example, capable of practice in sequences other than those illustrated or described herein.

[0041] Generally, the polishing process includes two steps of rough polishing and fine polishing. The main function of rough polishing is to remove the damaged layer on the surface of the silicon wafer and improve the flatness of the surface of the silicon wafer; Grinding under different ...

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Abstract

Embodiments of the present invention provide a polishing apparatus and method. The polishing apparatus includes: at least one first polishing head, and each first polishing head includes: a first suction cup made of a first material. When the first suction cup is used to fix the to-be-to-be-used When processing the silicon wafer, the first surface of the silicon wafer to be processed is attached and connected to the first suction cup; at least one second polishing head, each second polishing head includes: a second suction cup made of a second material, and a second suction cup of the second material. The hardness is greater than the first material. When the second suction cup is used to fix the silicon wafer to be processed, the first surface of the silicon wafer to be processed is attached and connected to the second suction cup; at least one polishing disc, the polishing disc is connected to the first polishing head and the The second polishing head is rotatably connected, and the second surface of the silicon wafer to be processed opposite to the first surface is ground on the polishing disc through the first polishing head and the second polishing head respectively, so that the surface of the silicon wafer to be processed can be improved. The flatness of the silicon wafer can also be reduced, and the residual number of particles on the surface of the silicon wafer to be processed can be reduced, thereby obtaining a silicon wafer with excellent surface performance.

Description

technical field [0001] The invention relates to the field of silicon wafer processing, in particular to a polishing device and method. Background technique [0002] Silicon material is the main substrate material for the manufacture of VLSI. With the rapid development of the semiconductor industry, the precision requirements for substrate materials are getting higher and higher, so the quality requirements for silicon wafers are becoming more and more stringent, especially for silicon Sheet surface flatness requirements. However, existing polishing equipment and methods cannot meet the quality requirements of silicon wafers. Contents of the invention [0003] Embodiments of the present invention provide a polishing device and method to solve the problem that the existing polishing device and method cannot meet the quality requirements of silicon wafers. [0004] In the first aspect, in order to solve the above technical problems, an embodiment of the present invention pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B27/00B24B41/06B24B1/00
CPCB24B1/00B24B27/0076B24B27/0092B24B41/06
Inventor 白宗权
Owner XIAN ESWIN SILICON WAFER TECH CO LTD
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