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Bonding device and bonding method

A bonding device, 3D technology, applied in lamination devices, chemical instruments and methods, lamination, etc., can solve problems such as blisters

Active Publication Date: 2021-05-18
INTERFACE TECH CHENGDU CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to provide a bonding device and a bonding method for the problem of bubbles in the central area of ​​the bonded product

Method used

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  • Bonding device and bonding method
  • Bonding device and bonding method
  • Bonding device and bonding method

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Embodiment Construction

[0035] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0036] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes ...

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Abstract

The invention relates to a bonding device. The bonding device includes: a bearing platform for carrying 3D elements; an adjustment mechanism for placing between the 3D element and the undeformed deformed element, and the adjustment mechanism can switch between the first working state and the second working state; When the adjustment mechanism is in the first working state, the adjustment mechanism has a first avoidance through hole facing the 3D element, and the first avoidance through hole can pass through the deformation element that undergoes the first deformation towards the 3D element, and the adjustment mechanism can The deformation element blocks, so that after the first deformation, the distance between the central area of ​​the 3D element and the deformation element is less than the distance between the edge area of ​​the 3D element and the deformation element; when the adjustment mechanism is in the second working state, the deformation After the element undergoes a second deformation towards the 3D element, the deformed element is attached to the 3D element. In this way, the formation of blisters in the central area of ​​the product can be effectively avoided, thereby enabling the product to have better performance.

Description

technical field [0001] The invention relates to the technical field of bonding, in particular to a bonding device and a bonding method. Background technique [0002] In the production process of touch display devices, it is often necessary to use a bonding device to bond two components together, for example, bonding the touch film to the protective cover, and bonding the polarizer film to the substrate (Lens) on. However, with the continuous development of touch display technology, touch display products are gradually developing from planar 2D products to curved 3D products, and the structure of the bonding device used in the bonding process has also changed accordingly. For example, in the planar bonding process, the pressure head of the laminating device descends with a component, and directly presses the component on another component located on the carrier table (one component is provided with a Component adhesive), and in the surface bonding process, under the action ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/10B32B37/06B32B37/00B32B37/12
CPCB32B37/003B32B37/06B32B37/10B32B37/1207B32B2315/08
Inventor 王柏森陈芸霈
Owner INTERFACE TECH CHENGDU CO LTD