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Chip packaging method

A packaging method and chip technology, which can be used in the manufacture of electrical components, electrical solid devices, semiconductors/solid devices, etc., and can solve problems such as low chip efficiency

Inactive Publication Date: 2019-10-18
上海瑞章物联网技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the sizes of the three color chips are different, making it inefficient to embed chips of different sizes using existing packaging methods

Method used

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Experimental program
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Embodiment Construction

[0023] As mentioned in the background art, the efficiency of embedding micro light-emitting diodes using existing packaging methods is low.

[0024] figure 1 It is a structural schematic diagram of a chip package structure with different sizes.

[0025] Please refer to figure 1 , providing the substrate 100, the substrate 100 has a plurality of mutually separated first openings (not shown in the figure), second openings (not shown in the figures) and third openings (not shown in the figures); Utilize manipulator (not shown in the figure), embed red chip 101a in the first opening, embed green chip 101b in the second opening, embed blue chip 101c in the 3rd opening, and described red chip 101a, green chip 101b and blue chip 101c are different in size from each other.

[0026] In the above method, in order to realize the embedding of the red chip 101a, the green chip 101b and the blue chip 101c, the red chip 101a, the green chip 101b and the blue chip 101c are respectively emb...

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Abstract

The invention discloses a chip packaging method. The chip packaging method comprises the following steps: providing a substrate, wherein a plurality of first openings are formed in the substrate; providing a plurality of first chips, wherein the shape of each first chip is complementary to that of each first opening; embedding all the first chips into the first openings by adopting a first fluid self-packaging process for at least one time; after all the first chips are embedded into the first openings, forming a plurality of second openings in the substrate; providing a plurality of second chips, wherein the shape of each second chip is complementary to that of each second opening, and the size of each second chip is different from that of each first chip; and embedding all the second chips into the second openings by adopting a second fluid self-packaging process for at least one time. The packaging method can improve the embedding efficiency of the first chips and the second chips.

Description

technical field [0001] The invention relates to the packaging field, in particular to a chip packaging method. Background technique [0002] Micro LEDs (Micro LEDs) have the characteristics of energy saving, simple structure, small size and thinness. Moreover, Micro LEDs also have the characteristics of self-illumination, so that Micro LEDs do not need a backlight source and have high resolution. Micro LEDs are viewed as It is the next-generation display technology after OLED. The luminous efficiency of micro-light-emitting diodes is better than that of OLEDs, and the difference between the two can reach 2 to 3 times. Therefore, for displays with the same brightness, the battery life of micro-light-emitting diode displays is 2 to 3 times longer than that of OLED batteries. times, which is beneficial to solve the power consumption problem of the display screen. [0003] Micro light emitting diodes usually include chips of three colors, specifically, the chips of three color...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/52H01L33/48
CPCH01L21/52H01L33/48H01L2933/0033H01L2224/95101
Inventor 张晓勇吴坤旭赖磊平
Owner 上海瑞章物联网技术有限公司