Stress-free package structure suitable for MEMS absolute pressure sensor and packaging method thereof
A pressure sensor and packaging structure technology, applied in the direction of measuring fluid pressure, instruments, measuring force, etc., can solve the problems of packaging shell deformation, internal stress, affecting the test accuracy of pressure sensors, etc., to avoid zero drift and accurate and reliable measurement accuracy Effect
Pending Publication Date: 2019-10-22
LONGWAY TECH WUXI
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Problems solved by technology
[0004] In view of the deficiencies in the background technology, the problem solved by the present invention is that the MEMS pressure sensor in the prior art adopts a traditional package structure, and its package shell is deformed by heat and force, and internal stress is generated, which in turn affects the test accuracy of the pressure sensor
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[0032] The present invention is described in further detail now in conjunction with accompanying drawing. These drawings are all simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, so they only show the configurations related to the present invention.
[0033] Such as Figure 1-3 As shown, the stress-free packaging structure suitable for MEMS absolute pressure sensors includes bottom plate 1, first support layer 2, middle layer 3, second support layer 4 and cover plate 5 connected sequentially from bottom to top, bottom plate 1, The first support layer 2, the middle layer 3, the second support layer 4 and the cover plate 5 are all made of insulating materials;
[0034] Both the first support layer 2 and the second support layer 4 are hollowed out in the center. The first support layer 2 and the second support layer 4 play the role of isolating stress while playing a supporting role. The stress transmitted by...
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The invention relates to the technical field of sensor package and discloses a stress-free package structure suitable for an MEMS absolute pressure sensor and a packaging method thereof. The stress-free package structure comprises a bottom plate, a first support layer, an intermediate layer, a second support layer and a cover plate, which are connected in sequence from the bottom up. The bottom plate, the first support layer, the intermediate layer, the second support layer and the cover plate are made of an insulation material. The stress-free package structure solves the problem that since an MEMS pressure sensor adopts a traditional package structure, a package housing of the pressure sensor is deformed by heat and force, inner stress is generated, and test accuracy of the pressure sensor is affected. The bottom plate, the first support layer, the intermediate layer, the second support layer and the cover plate jointly form a package housing with a cavity inside, and a platform forfixing a pressure sensor chip is almost suspended in the cavity, thereby eliminating the influence of deformation of the package housing caused by heat and force on the measurement accuracy of the pressure sensor, and effectively ensuring accurate and reliable measurement accuracy of the pressure sensor.
Description
technical field [0001] The invention relates to the technical field of sensor packaging, in particular to a stress-free packaging structure suitable for MEMS absolute pressure sensors and a packaging method thereof. Background technique [0002] Traditional MEMS pressure sensors use the package substrate to paste the pressure sensor chip, and reserve a vent hole at the bottom of the substrate or the upper cover of the pressure sensor to measure the pressure. When parameters such as temperature and pressure change, the packaging shell of the pressure sensor is heated and deformed by force, which will generate internal stress, which will affect the test accuracy of the pressure sensor. The larger the volume of the packaging shell, the greater the impact from the outside world. [0003] The packaging shell of the traditional pressure sensor adopts standard standards, including plastic packaging, ceramics, metal, etc., but due to the impact of external force or temperature on th...
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IPC IPC(8): G01L1/00G01L19/00
CPCG01L1/00G01L19/00
Inventor 汪祖民
Owner LONGWAY TECH WUXI