Micro light emitting diode transfer substrate and device

A technology of micro-light-emitting diodes and transfer substrates, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of large spacing between micro-light-emitting diodes, inability to meet the high-precision requirements of mass transfer, and low accuracy

Active Publication Date: 2019-10-25
BOE TECH GRP CO LTD +1
View PDF11 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The inventors found that there are at least the following problems in the prior art: the mass transfer of existing micro-LED elements generally has low accuracy, and the distance between micro-LED elements is relatively large, which cannot meet the high-precision requirements of mass transfer

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Micro light emitting diode transfer substrate and device
  • Micro light emitting diode transfer substrate and device
  • Micro light emitting diode transfer substrate and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] An embodiment of the present invention provides a transfer substrate for micro-light emitting diodes, which can be used for mass transfer of micro-light-emitting diodes in the process of manufacturing micro-light-emitting diode display panels, Figure 1a with Figure 1b A schematic diagram of a side-view structure of a micro-LED transfer substrate provided in an embodiment of the present invention, as shown in Figure 1a with Figure 1b As shown, the micro light emitting diode transfer substrate provided by the embodiment of the present invention includes: a base 101 and a distance adjustment unit 102 . The base 101 has a plurality of bases 1011 arranged at intervals; the bases 1011 are used to carry the micro light-emitting diodes to be transferred; the distance adjustment unit 102 is arranged between two adjacent bases 1011 for adjusting the distance between the bases 1011 .

[0028] In the initial state of the micro light-emitting diode transfer substrate provided b...

Embodiment 2

[0045] Based on the same inventive concept, an embodiment of the present invention provides a micro-LED transfer device, the micro-LED transfer transposition includes the micro-LED transfer substrate provided in the above embodiment, and also includes a push module, the push module and the distance adjustment unit The connection is used to apply an external force to the distance adjustment unit, so that the distance adjustment unit can adjust the distance between the bases.

[0046] It should be noted that the push module can apply external force to the micro-LED transfer substrate, so that the distance adjustment unit is in a stretched or contracted state, so the distance between adjacent bases can be shortened, thereby shortening the distance between the micro-light-emitting diodes to be transferred. The distance between them can further improve the accuracy of the mass transfer of micro-light emitting diodes, and realize the high-precision mass transfer of micro-light-emitti...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a micro light emitting diode transfer substrate and device, which belongs to the technical field of display and can solve a problem of generally low precision of mass transfer of the existing micro light emitting diode elements. The micro light emitting diode transfer substrate comprises a base and distance adjusting units, wherein the base is provided with a plurality of pedestals arranged at intervals; the pedestals are used for bearing micro light emitting diodes to be transferred; and the distance adjusting unit is arranged between two adjacent pedestals and used foradjusting the distance between the pedestals.

Description

technical field [0001] The invention belongs to the field of display technology, and in particular relates to a micro-light-emitting diode transfer substrate and a device. Background technique [0002] Micro light emitting diode (Micro-LED) display technology is to miniaturize and matrix traditional display devices, and use integrated circuit technology to make driving circuits, so as to realize the addressing control and individual driving of each pixel. display technology. Due to its various indicators such as brightness, life, contrast, response time, energy consumption, viewing angle and resolution, it is due to traditional display technology. And it has the advantages of self-illumination, simple structure, small size and energy saving, and is regarded as the next generation display technology. [0003] At present, in the process of manufacturing Micro-LED display panels, micro-light-emitting diodes are first formed on the transfer substrate, and then a huge amount of...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L27/15
CPCH01L21/6835H01L27/156H01L2221/68363H01L2221/68381H01L2221/68322H01L2221/68354H01L21/67138H01L25/0753H01L24/95H01L2221/68368H01L2224/95001H01L2924/12041H01L2224/75724H01L2224/7598H01L24/75H01L2224/75755H01L21/6833
Inventor 孙含嫣刘东琦郑辉杨啸剑
Owner BOE TECH GRP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products