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Substrate processing apparatus and substrate holding apparatus

一种基板处理装置、基板保持的技术，应用在磨削工件支架、电气元件、工作载体等方向，能够解决难除去异物等问题

Pending Publication Date: 2019-10-29
EBARA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in the conventional method, such as a method using a single scrubbing process, it is sometimes difficult to remove foreign matter from the entire upper surface (front or back) of the wafer.

Method used

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  • Substrate processing apparatus and substrate holding apparatus
  • Substrate processing apparatus and substrate holding apparatus
  • Substrate processing apparatus and substrate holding apparatus

Examples

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Embodiment Construction

[0145] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in the drawings described below, the same reference numerals are assigned to the same or corresponding constituent elements, and repeated descriptions are omitted. Among the plurality of embodiments described below, the configuration of one embodiment not particularly described is the same as that of the other embodiments, and thus redundant description thereof will be omitted.

[0146] figure 1 (a) and figure 1 (b) is an enlarged cross-sectional view showing a peripheral portion of a wafer as an example of a substrate. In more detail, figure 1 (a) is a cross-sectional view of a so-called straight wafer, figure 1 (b) is a sectional view of a so-called circular wafer. exist figure 1 In the wafer W of (a), the groove portion is composed of an upper slope portion (upper groove portion) P, a lower slope portion (lower groove portion) Q, and a side portion (...

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PUM

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Abstract

A substrate processing apparatus which can remove foreign matters attached to the entire upper surface of a substrate such as a wafer is disclosed. The substrate processing apparatus includes: a substrate holding apparatus (1); and a processing head (50) configured to scrub an upper surface (US) of a substrate (W). The substrate holding apparatus (1) includes: a substrate holder (5) configured tohold the substrate (W); and a substrate rotating mechanism (10) configured to rotate the substrate (W) held by the substrate holder (5). The substrate holder (5) is disposed below the upper surface ofthe substrate (W) so as not to project above the upper surface (US) of the substrate (W) in a state where the substrate (W) is held by the substrate holder (5).

Description

technical field [0001] The present invention relates to a substrate processing device for processing a substrate such as a wafer, and a substrate holding device for holding the substrate. Background technique [0002] In recent years, devices such as memory circuits, logic circuits, and image sensors (such as CMOS sensors) are being further highly integrated. In the process of forming these devices, foreign substances such as fine particles and dust may adhere to the devices. Foreign matter adhering to the device may cause a short circuit between wirings or a malfunction of the circuit. Therefore, in order to improve the reliability of the device, it is necessary to clean the wafer on which the device is formed to remove foreign matter on the wafer. [0003] Foreign matter such as fine particles and dust as described above may also adhere to the back surface of the wafer. When such foreign matter adheres to the back surface of the wafer, the wafer is separated from the st...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/687H01L21/67
CPCH01L21/68792H01L21/67046H01L21/67051B24B37/30H01L21/6838H01L21/67219H01L21/68742H01L21/68721B24B41/067B08B1/30B08B1/32H01L21/67028H01L21/68764B08B1/165
Inventor 小林贤一户川哲二
Owner EBARA CORP
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