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A kind of leadless packaging semiconductor product and its processing method

A leadless packaging and processing method technology, applied in semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve problems such as insufficient insulation distance and creepage distance, and achieve increased insulation distance and creepage distance, The effect of increasing distance

Active Publication Date: 2021-04-20
GREAT TEAM BACKEND FOUNDRY (DONGGUAN) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] An object of the embodiments of the present invention is to provide a leadless packaged semiconductor product, which can solve the problems of insufficient insulation distance and creepage distance of existing leadless packaged products

Method used

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  • A kind of leadless packaging semiconductor product and its processing method
  • A kind of leadless packaging semiconductor product and its processing method
  • A kind of leadless packaging semiconductor product and its processing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Such as Figure 1-Figure 1EAs shown, the present embodiment provides a leadless packaged semiconductor product, including an encapsulation resin forming the outline of the product body and a chip 2 encapsulated by the encapsulation resin, and the chip 2 has opposite first surfaces and second surfaces , the first surface is provided with several lead frames 6, the second surface is provided with metal wires 4 and metal sheets 3 connecting the chip 2 and the lead frames 6, and the metal sheet 3 includes a metal sheet main body, The sheet metal connector and the sheet metal bracket, the sheet metal body, the sheet metal connector, and the sheet metal bracket are integrally structured, and the first end surface of the sheet metal is located on the sheet metal bracket away from the sheet metal body The end portion of the metal sheet main body is electrically connected to the chip 2 through the solder material 5, and the metal sheet connector is electrically connected to the ...

Embodiment 2

[0051] Such as Figure 2-2E As shown, the structure of the leadless packaged semiconductor product described as a preferred technical solution is basically the same as that of the second embodiment, the main difference being that the first end surface of the metal sheet is provided with an insulating sealing material 7 .

Embodiment 3

[0053] In other embodiments of the present invention, the structure of the leadless packaged semiconductor product can also be: the product body includes a first package body 8 and a second package body 9, and the first package body 8 and the second package body The outer dimensions of the two packages 9 are the same, the first end surface of the frame extends to the side of the first package 8 , and there is a certain distance between the first end surface of the metal sheet and the side of the second package 9 .

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PUM

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Abstract

The invention discloses a leadless packaged semiconductor product and a processing method thereof. The product includes a packaging resin forming the outline of a product body, a chip encapsulated by the packaging resin, a lead frame, and a metal sheet. The metal sheet includes a metal sheet bracket, a metal sheet The bracket and the lead frame respectively have a first end surface of the metal sheet facing the outer surface of the packaging resin and a first end surface of the frame, the first end surface of the frame is flush with the outermost outer surface of the packaging resin, and the first end surface of the metal sheet is flush with the outermost surface of the packaging resin. There is a certain distance between the surfaces. Through the above arrangement, the metal sheet support and the lead frame on the same side of the product extend different distances in the product, that is, the distances from the same side are different, so that the distance between the first end surface of the metal sheet and the first end surface of the frame is not only including The distance in the vertical direction also includes the distance in the horizontal direction, so the distance between the two is actually increased, thereby increasing the insulation distance and the creepage distance.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a leadless packaged semiconductor product and a processing method thereof. Background technique [0002] There is a voltage difference between different electrodes of semiconductor components during use, so a certain space insulation distance and creepage distance are required between different electrodes to prevent leakage and short circuits during use. [0003] With the continuous development of high-power and high-voltage electronic devices, the requirements for semiconductor chip packages are also getting higher and higher. Also, as electronic devices, such as radiotelephones, become smaller, there is a need to manufacture smaller semiconductor chip packages so that they can be included in these electronic devices. However, smaller packages often require smaller semiconductor die, which can affect internal performance and shorten creepage distances. [0004] At prese...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/498H01L23/495H01L23/31
CPCH01L23/49805H01L23/49838H01L23/49541H01L23/3121H01L2224/40245H01L2924/181H01L2224/48247H01L2224/73221H01L2924/00012
Inventor 曹周
Owner GREAT TEAM BACKEND FOUNDRY (DONGGUAN) LTD