Vapor and Folding Terminals
A vapor chamber and heat soaking technology, which is applied in cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problem that the cooling device cannot meet flexible bending and high thermal conductivity at the same time, and achieve good Thermal conductivity, the effect of improving the overall performance
Active Publication Date: 2021-06-01
HUAWEI TECH CO LTD
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Problems solved by technology
[0004] The embodiment of the present application provides a vapor chamber and a folding terminal to solve the problem that the heat dissipation device cannot meet the requirements of flexible bending and high thermal conductivity at the same time
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[0057] The technical solution in this application will be described below with reference to the accompanying drawings.
[0058] In response to the current consumers' pursuit of large-screen experience, folding terminals have become an important trend in the development of next-generation terminal equipment, and research on folding terminal equipment has also received more and more attention. Among them, the heat dissipation of folding terminals is an important aspect that cannot be ignored in the research process of folding terminals. The heat dissipation performance is an important factor affecting whether the terminal can have good performance. For a foldable terminal, heat-generating elements such as chips are often arranged on one side of the foldable terminal. At this time, if the heat-dissipating element is arranged on this side, the heat cannot be sufficiently diffused. A better implementation is to install heat dissipation elements on both sides of the folding termina...
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The application provides a vapor chamber, which relates to the field of heat dissipation devices. The heat soaking plate includes: a first heat equalizing part, including a first cavity and a first capillary layer disposed in the first cavity, wherein the first cavity includes a first upper cover plate and a first lower cover A cover plate; a second heat equalizing part, including a second cavity and a second capillary layer disposed in the second cavity, wherein the second cavity includes a second upper cover plate and a second lower cover plate; a connecting portion, the connecting portion is arranged between the first heat equalizing portion and the second heat equalizing portion, and is connected with the first heat equalizing portion and the second heat equalizing portion, wherein the connecting portion A plurality of through holes penetrating along the height direction of the connecting portion are provided. The vapor chamber provided by the present application can ensure high thermal conductivity while having good bending performance, and is suitable for folding terminals that require repeated bending.
Description
technical field [0001] The present application relates to the field of heat transfer devices, and more specifically, to a vapor chamber and a folding terminal. Background technique [0002] With the development of smart terminal devices, folding terminals have received more and more attention. On the one hand, the folding terminal can meet the user's demand for a large screen experience; on the other hand, the folding terminal also has the advantages of being easy to carry. However, in the research process of folding terminals, it is necessary to break through the technical barriers in several key areas, among which the heat dissipation of folding terminals is an important issue that cannot be ignored. The next-generation terminal pursues the ultimate experience and performance improvement, and the heat generated by the terminal will also increase. In addition, according to the chip layout of the general folding terminal, the heat will often be concentrated on one side of t...
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IPC IPC(8): H05K7/20
CPCH05K7/20336
Inventor 俞涵如靳林芳施健袁志周阿龙
Owner HUAWEI TECH CO LTD