External protection device for chip silicon production and using method of external protection device

A protection device and chip technology, which is applied to fine working devices, electrical components, circuits, etc., can solve problems such as unsatisfactory use effect, increased operator labor, and manual cleaning.

Pending Publication Date: 2019-11-08
DATONG XINCHENG NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide an external protection device for chip silicon production in order to solve the above problems, so as to solve the problem that the current protection device in the prior

Method used

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  • External protection device for chip silicon production and using method of external protection device
  • External protection device for chip silicon production and using method of external protection device
  • External protection device for chip silicon production and using method of external protection device

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Embodiment Construction

[0029] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be described in detail below. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other implementations obtained by persons of ordinary skill in the art without making creative efforts fall within the protection scope of the present invention.

[0030] see Figure 1-Figure 6 As shown, the present invention provides an external protective device for chip silicon production, including a lower cover 1 and a top plate 6, the lower cover 1 surrounds the outer sides of two power rollers 2, and the surface of the top plate 6 is provided with a through groove 601 and a lift The hole 602 and the through groove 601 are located at the center of the top plate 6 and correspond to the drive table 10. There are two l...

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Abstract

The invention discloses an external protection device for chip silicon production and a using method of the external protection device. The device comprises a top plate, wherein a fixing frame is integrally arranged on the bottom surface of the top plate, the two outer sides of the fixed frame are respectively connected with a guide plate, a guide hole is formed in the surface of the guide plate in a penetrating mode, a lifting frame is arranged on the outer side of the fixing frame in a sleeved mode, a guide column is installed on the upper surface of the bearing plate, a compression spring sleeves the outer side of the guide column, the upper end of the guide column penetrates through the guide hole and is connected with a connecting plate, the bottom surface of the connecting plate is connected with a lifting column, the bottom end of the lifting column extends into the fixed frame and is connected with an elastic telescopic rod, and a scraper plate is arranged at the telescopic endof the elastic telescopic rod. The device has the beneficial effects that the bearing plate is pressed by the pressing spring, so that the bearing plate is driven by the guide column, the connectingplate and the lifting column to descend, the inner wall of the fixed frame is scraped by the scraper, and manual scraping is not needed, so that the mortar can be recycled.

Description

technical field [0001] The invention relates to the technical field of medicine taking devices, in particular to an external protection device for chip silicon production and a method of use thereof. Background technique [0002] Chips made of silicon wafers are known as "magic operators" with amazing computing power. In the production process of silicon wafers, multi-wire cutting devices are often used to cut silicon ingots to obtain silicon wafers. During the cutting process, the driving table drives the silicon ingots up and down, and the power roller drives the cutting wire with mortar to rotate. Silicon ingots are cut, in order to prevent the mortar from splashing during cutting and to facilitate the recycling and reuse of the mortar, protective devices are required for protection. However, the current protective device prevents the mortar from splashing, and cannot automatically scrape off the mortar adhered to the inner wall. Manual cleaning is required, which increa...

Claims

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Application Information

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IPC IPC(8): B28D5/00B28D5/04H01L21/02
CPCB28D5/04B28D5/0058B28D5/0076H01L21/02005
Inventor 郭志宏
Owner DATONG XINCHENG NEW MATERIAL CO LTD
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