Semiconductor refrigeration system

Abstract

The invention discloses a semiconductor refrigeration system. The system comprises a semiconductor refrigeration piece, a cold conduction block attached to the cold end face of the semiconductor refrigeration piece, a metal aluminum inner container attached to one surface, far away from the semiconductor refrigeration piece, of the cold conduction block, a heat radiator attached to the heat end face of the semiconductor refrigeration piece, the size of one face, attached to the semiconductor chilling plate, of the cooling block is the same as the size of one face, attached to the semiconductorchilling plate, of the cooling block, and the area, attached to one face, of the cooling block and the metal aluminum liner is larger than that of one face, which is attached to the semiconductor chilling plate, of the cooling block. According to the scheme, compared with the prior art, the area of lamination of the cold guide block and the metal aluminum liner is increased, so that the heat exchange efficiency of the cold guide block and the metal aluminum liner is improved.

Description

technical field [0001] The invention relates to the field of refrigeration equipment, in particular to a semiconductor refrigeration system. Background technique [0002] A semiconductor cooling chip is a tool for heat transfer. When a current flows through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer will occur between the two ends, and the heat will flow from one end to the other. Transfer to the other end, thus creating a temperature difference to form a hot and cold end. Due to the advantages of having no sliding parts, the semiconductor refrigeration sheet can be used in some occasions where the space is limited, the reliability is high, and there is no refrigerant pollution. [0003] Please refer to the traditional semiconductor refrigeration system figure 1 , including a semiconductor cooling chip, a cold guide block attached to one side of the semiconductor cooling chip, a metal aluminu...

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Problems solved by technology

[0004] In the traditional semiconductor refrigeration system, the semiconductor refrigeration chip is a rectangular parallelepiped structure, its upper bottom is square, and the size of the upper bottom is generally 40*40mm, and the height is about 4mm. Among them, the cooling block is also a rectangular parallelepiped structure, and its upper bottom is It is a square, and the size of the upper bottom surface is the same as that of the semiconductor refrigeration sheet. Therefore, the bonding area between the cold guide block and the metal aluminum liner is the area of ​​the upper bottom surface of the cold guide block. When the gallbladder heat exchange, the efficiency is low

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