Dual-array package light source structure and packaging method thereof

A light source and installation groove technology, which is applied to electrical components, electrical solid devices, circuits, etc., can solve the problems of complex LED chip packaging procedures, heat generated by LED chips, and low processing efficiency, so as to improve the dustproof effect and heat dissipation speed , the effect of prolonging the service life
CN110429079AActive Publication Date: 2019-11-08广东良友科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
广东良友科技有限公司
Publication Date
2019-11-08

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Abstract

The invention relates to the technical field of LED production, in particular to a dual-array package light source structure and a packaging method thereof. The dual-array package light source structure comprises a substrate, two symmetric heat dissipation slots are arranged on the top surface of the substrate, LED chips are symmetrically arranged at two sides of each heat dissipation slot, the inner wall of the each heat dissipation slot is provided with a heat dissipation through hole, each LED chip is provided with a mounting groove, threaded holes are symmetrically arranged at the two sides of the substrate; the top portion of the substrate is provided with an isolation frame, a glass sheet is arranged between the isolation frame and the substrate, the isolation frame comprises a frame, and fixed plates are symmetrically arranged at the two sides of the frame. The dual-array LED chips are arranged to improve the light emitting speed and improve the brightness; by arranging the heatdissipation slots and the heat dissipation through holes and communicating the heat dissipation through holes with the mounting grooves in the LED chips, the heat dissipation speed of the LED chips is improved, the service life is prolonged, the maintenance cost is reduced, the fixed plates pass through the fixed holes and the threaded holes in order through fixed bolts to be connected on the substrate to facilitate fixing of the glass sheet and facilitate mounting and dismounting.
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Description

technical field

[0001] The invention relates to the technical field of LED production, in particular to a double-array packaged light source structure and a package method. Background technique

[0002] A light-emitting diode (Light-EmittingDiode, LED) is a semiconductor electronic component capable of emitting light. This electronic component appeared as early as 1962. In the early days, it could only emit red light with low luminosity. Later, other monochromatic light versions were developed. Today, the light that can be emitted has covered visible light, infrared rays and ultraviolet rays, and the luminosity has also increased to a considerable extent. of luminosity. And the use is also used as indicator lights, display panels, etc. from the beginning; with the continuous advancement of technology, light-emitting diodes have been widely used in displays, TV lighting decoration and lighting.

[0003] There are many packaging methods for LEDs. At present, a common packagi...

Claims

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