Flexible circuit board that can be used in the field of flexible tactile sensing and its manufacturing method
A flexible circuit board, tactile sensing technology, used in the removal of conductive materials by chemical/electrolytic methods, printed circuits, printed circuits, etc.
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[0036] combine figure 1 and figure 2 As shown, the embodiment discloses an FPC flexible board, which mainly includes a flexible substrate 1 , a signal sensing area 2 and a signal output connection portion 3 .
[0037] The flexible base material 1, that is, the PI base film, has the characteristics of high temperature resistance, bendability, flexible connection and insertion reliability, and the like.
[0038] The signal sensing area 2 is located on the front of the flexible substrate, and mainly includes the sensing area body 21, the signal input end 22 and the signal output end 23, and the sensing area body 21 is connected to the signal output connection part 3 through the signal input end 22 and the signal output end 23 .
[0039] The material of the sensing area body 2 is mainly Ag, which is formed on the signal sensing reserved area on the front of the flexible substrate 1 by printing. The Ag coating is mainly composed of conductive silver powder and resin, which has g...
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