Flexible circuit board used for flexible touch sensing field and manufacturing method thereof
A flexible circuit board, tactile sensing technology, applied in chemical/electrolytic methods to remove conductive materials, printed circuits, printed circuits, etc., to achieve the effect of ensuring reliable and effective output
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0036] Combine figure 1 with figure 2 As shown, the embodiment discloses an FPC flexible board, which mainly includes a flexible substrate 1, a signal sensing area 2 and a signal output connecting portion 3.
[0037] The flexible substrate 1, namely the PI base film, has the characteristics of high temperature resistance, bendable, flexible connection and insertion reliability.
[0038] The signal sensing area 2 is located on the front side of the flexible substrate, and it mainly includes a sensing area body 21, a signal input terminal 22 and a signal output terminal 23. The sensing area body 21 is connected to the signal output connection part 3 through a signal input terminal 22 and a signal output terminal 23 .
[0039] The material of the sensing area body 2 is mainly Ag, which is formed on the signal sensing reserved area on the front of the flexible substrate 1 by printing. The Ag coating is mainly composed of conductive silver powder and resin, which has good flexibility, be...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com