Detection method and device of transmission pipeline roughness

Abstract

The invention provides a detection method and device of transmission pipeline roughness. The device comprises an emitting end bracket and a receiving end bracket in opposite arrangement, and a carrierbracket located between the emitting end bracket and the receiving end bracket; the carrier bracket is used for bearing the transmission pipeline; a light source for emitting ray to the inner wall ofthe transmission pipeline is arranged on the emitting end bracket, a condensing lens for gathering and receiving the refracted ray passing through the inner wall of the transmission pipeline is arranged on the receiving end bracket; the condensing lens is connected with a light intensity sensor through an optical fiber; the light intensity sensor is used for measuring the light intensity passingthrough the inner wall of the transmission pipeline, the light intensity sensor is in circuit connection with a controller, and the controller can measure the light intensity of the inner wall of thetransmission pipeline through the light intensity sensor and judge the roughness of the inner wall of the transmission pipeline. The roughness of the inner wall of the transmission pipeline can be detected.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method and device for detecting the roughness of a transmission pipeline. Background technique [0002] Chemical vapor deposition (Chemical Vapor Deposition, CVD) is a chemical technology, which mainly uses one or several gas-phase compounds or simple substances containing thin film elements to perform chemical reactions on the surface of the substrate to form thin films. In the field of semiconductor technology, 1 / 4-inch stainless steel pipes are mostly used as gas and liquid delivery pipes in CVD process equipment. After long-term use, some pipes need to be replaced. Because the roughness of the inner wall of the pipe may be different, it will lead to failure after replacement. The uneven distribution of gas in different reaction chambers, the change of the flow direction of the gas entering the reaction chamber, etc., lead to the change of process parameters. Therefo...

AI Technical Summary

Problems solved by technology

In the field of semiconductor technology, 1 / 4-inch stainless steel pipes are mostly used as gas and liquid delivery pipes in CVD process equipment. After long-term use, some pipes need to be replaced. Because the roughness of the inner wall of the pipe may be different, it will lead to failure after replacement. Uneven gas distribution in different reaction chambers, changes in the flow direction of gases entering the reaction chamber, etc., resulting in changes in process parameters

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