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Method for selecting axis direction and grinding angle of single crystal diamond conical indenter
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A single crystal diamond, axial direction technology, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve the problems of limiting the application of conical indenters, indenter surface error, low manufacturing level, etc., to reduce adverse effects Effect
Active Publication Date: 2019-11-12
HARBIN INST OF TECH
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For the processing of diamond pyramid indenters, it is only necessary to find the easy-to-grind directions for several specific planes, but for the processing of diamond conical indenters, due to the strong anisotropy of diamond single crystal, the 360° rotation space is different along the The mechanical grinding efficiency varies greatly with different crystal orientations, so it is necessary to find the optimal grinding angle for the continuous curved surface that constitutes the diamond conical surface
At present, the main difficulties in the processing of diamond conical indenters are the anisotropic surface roughness of the conical surface and the indenter surface error caused by the anisotropy of the grinding efficiency.
[0005] The processing of diamond cone indenters is very difficult, but there are few reports on the axial direction of high-precision diamond cone indenters and the selection method of mechanical grinding angle, which undoubtedly limits the application of cone indenters in nano-indentation detection
In addition, the manufacturing level of domestic diamond indenters is relatively low, and high-precision diamond conical indenters are heavily dependent on imports.
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specific Embodiment approach 1
[0028] Specific implementation mode one: as Figure 1 to Figure 10 As shown, the present invention discloses a method for selecting the axial direction and grinding angle of a single crystal diamond conical indenter, comprising the following steps:
[0029] Step 1: Determine the grindability factor according to the microscopic shear strength of the typical crystal plane of single crystal diamond crystal, such as figure 1 As shown, the modeling area is designed according to the projected spherical surface of the single crystal diamond crystal plane, and within 1 / 48 of the modeling area, the three typical crystal planes (100), (110) and (111) are easily The grindability factor is weighted and superimposed, and the grindability factor of the general crystal plane and crystal orientation of the single crystal diamond crystal is calculated. The calculation method of the physical eigenvalues of the general crystal planecrystal orientation is the prior art;
[0030] Step 2: Base...
specific Embodiment approach 2
[0039] Specific embodiment 2: This embodiment is a further description of specific embodiment 1. In said step 1, the shear strength of the typical crystal plane and crystal orientation of a single crystal diamond crystal is set as τ, then its grindability factor calculation formula for:
[0040]
[0041] For the typical crystal orientation of single crystal diamond crystal, the larger the grindability factor is, the easier it is to grind, and vice versa, the harder it is to grind.
specific Embodiment approach 3
[0042] Specific embodiment three: This embodiment is a further description of specific embodiment one. In the second step, a general crystal plane of a single crystal diamond crystal can be expressed as a six-dimensional vector:
[0043] (x po ,y po ,z po ,x d ,y d ,z d )
[0044] according to figure 2 In the process shown, the crystal orientation of a general crystal plane of a single crystal diamond crystal is equivalent to 1 / 48 of the modeling area described in step 1, and the equivalent six-dimensional vector is obtained as:
[0045] (x' po ,y' po ,z' po ,x' d ,y' d ,z' d )
[0046] Parallel point (x' po ,y' po ,z' po ), and its corresponding crystal plane vector is:
[0047]
[0048] The initial crystal orientation of the crystal plane point is expressed as:
[0049] (x s ,y s ,z s )
[0050] Then for crystal orientation (x' d ,y' d ,z' d ), and its corresponding orientation angle is:
[0051]
[0052] According to the calculation results ...
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Abstract
The invention discloses a method for selecting the axis direction and the grinding angle of a single crystaldiamond conical indenter, and belongs to the technical field of high-precision nanoindentation indenter manufacturing. The method comprises: determining an easy-to-grind degree factor according to the typical crystal face microcosmic shear strength, and obtaining the easy-to-grind degree factor of a general crystal face crystal orientation through weighted superposition calculation; calculating a grindability factor of a certain general crystal face crystal orientation based on a coordinate transformation method; calculating the grindability factor of a circle of the conical surface along different grinding directions; for the specific semi-cone angle, calculating the standard deviation of the grindability factor of the conical surface along different grinding directions to select the axis direction by taking different crystal orientations as the axis of the single crystaldiamond conical indenter; for the single crystaldiamond conical indenter with the specific axis as the direction and the specific semi-cone angle, calculating the standard deviation of the grindability factor of the conical surface in different grinding directions so as to select the grinding angle of the indenter. Through optimization, the adverse effect of the anisotropism characteristic of the single crystal diamond crystal on the grinding precision of the indenter can be obviously weakened.
Description
technical field [0001] The invention belongs to the technical field of manufacturing high-precision nano-indentation indenters, in particular to a method for selecting the axial direction and grinding angle of a single crystal diamond conical indenter. Background technique [0002] With the continuous advancement of the scientific and technological level of human society, the rapid development of MEMS manufacturing technology, bioengineering and thin film technology has put forward new requirements for the detection technology of material mechanical properties. The detection technology of micro-nano-scale mechanical properties of materials plays a vital role in these new technology fields. Nano-indentation technology is an important technology to detect the micro-mechanical properties of materials. The indenter is pressed into the surface of the material to be tested, and the indentation load and indentation depth are continuously recorded during the loading and unloading pr...
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