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423 results about "Single crystal diamond" patented technology

Diamond sensors, detectors, and quantum devices

A synthetic single crystal diamond material comprising: a first region of synthetic single crystal diamond material comprising a plurality of electron donor defects; a second region of synthetic single crystal diamond material comprising a plurality of quantum spin defects; and a third region of synthetic single crystal diamond material disposed between the first and second regions such that the first and second regions are spaced apart by the third region, wherein the second and third regions of synthetic single crystal diamond material have a lower concentration of electron donor defects than the first region of synthetic single crystal diamond material, and wherein the first and second regions are spaced apart by a distance in a range 10 nm to 100 μm which is sufficiently close to allow electrons to be donated from the first region of synthetic single crystal diamond material to the second region of synthetic single crystal diamond material thus forming negatively charged quantum spin defects in the second region of synthetic single crystal diamond material and positively charged defects in the first region of synthetic single crystal diamond material while being sufficiently far apart to reduce other coupling interactions between the first and second regions which would otherwise unduly reduce the decoherence time of the plurality of quantum spin defects and/or produce strain broaden of a spectral line width of the plurality of quantum spin defects in the second region of synthetic single crystal diamond material.
Owner:ELEMENT SIX LTD

Preparation method of high-performance diamond reinforced Al-matrix electronic packaging composite material

The invention relates to a preparation method of a high-performance diamond reinforced Al-matrix electronic packaging composite material, belonging to the field of metal-matrix composite materials. The preparation method is characterized by comprising the following steps: adding alloy elements into a pure Al matrix to prepare elemental mixed powder or Al alloy powder; uniformly mixing the elemental mixed powder or the Al alloy powder and diamond single crystal grains according to the volume percentage ratio of 75:25-40:60; adding the mixture into a graphite mold for carrying out spark plasma sintering, wherein the mixture is added at the heating speed of 50-100 DEG C/min until the sintering temperature is 580-800 DEG C and the sintering pressure is 30-40MPa; keeping the temperature and the pressure for 5-20min; and obtaining the high-performance diamond reinforced Al-matrix electronic packaging composite material after the sintering process finishes. The alloy elements comprise B, Si, Cr, Ti, Nb, Ag, Cu and the like. The material of the invention has the characteristics that the heat conductivity reaches 430W/m.K, the heat expansion coefficient is 6.40ppm/K, the compressive strength is 331MPa, and the density is only 3.13g/cm<3>. The invention effectively solves the problem of graphitization of single crystal diamond grains in the preparation process of the material, and has simple preparation processes and high production efficiency.
Owner:NEW MATERIAL INST OF SHANDONG ACADEMY OF SCI

Single point diamond lathe and method for machining special-shape workpiece

The invention provides a single point diamond lathe which comprises a workpiece axial displacement guide rail shaft (Z-axis) and a transversal displacement guide rail shaft (X-axis) of a normal numerically-controlled lathe and a single crystal diamond cutter, wherein a main shaft rotary indexing shaft (C-axis) is additively arranged on a radial displacement guide rail shaft; an angle-adjustable three-dimensional knife rest is arranged on the workpiece axial displacement guide rail shaft; the single crystal diamond cutter is fixed on the three-dimensional knife rest; a workpiece to be machined is fixed on the main shaft rotary indexing shaft; and the Z-direction displacement of the workpiece to be machined is adjusted by the workpiece axial displacement guide rail shaft. The invention further provides a method for controlling the X-direction displacement of the workpiece to be machined by the transversal displacement guide rail shaft and machining the special-shape workpiece. The invention compiles 2-3 shaft linkage by the C-axis indexing function of a single crystal diamond main shaft to be capable of realizing the planing contour machining on the cylindrical surface and the spherical surface, and has the characteristic that the special-shape workpiece is precisely machined.
Owner:SHANGHAI MODERN ADVANCED ULTRA PRECISION MFG CENT

Method of preparing high-performance diamond semiconductor based on low-cost single crystal diamond

The invention discloses a method for preparing a high-performance diamond semiconductor based on low-cost single crystal diamond, and belongs to the technical field of novel semiconductor preparation. The process steps include a, a commercially available cheap high temperature and pressure Ib-type single crystal diamond substrate is subjected to acid pickling to remove surface inclusions and form a passivated oxygen termination surface; b, the activated diamond surface is subjected to short time treatment by microwave hydrogen plasmas to expose a fresh C-C dangling bond; c, a high-quality single crystal diamond thin film is epitaxially grown on the fresh diamond surface by microwave plasma chemical vapor deposition to achieve the diamond thin film epitaxy with low dislocation density and impurity content mainly through the introduction of oxygen atoms with a self-healing function; and d, a carbon source and a oxygen source are turned off, the epitaxially grown diamond surface is treated by the microwave hydrogen plasmas to obtain a high hydrogen termination density, and the treated diamond surface is cooled to room temperature under a hydrogen atmosphere to obtain a diamond semiconductor with high conductivity. According to the invention, the process flow is simplified, the technical difficulty and the production cost are reduced, and the production cycle is shortened.
Owner:UNIV OF SCI & TECH BEIJING

Method for confirming grinding crystal orientation of diamond

The invention relates to a method for conforming grinding crystal orientation of a diamond, belonging to the technical field of ultra-precise machining. The method comprises the steps of (1) grinding a single crystal diamond so as to obtain an abrasive surface, wherein the abrasive surface and a crystal face to be ground intersect so as to form a ridge; (2) measuring the index of the crystal surface of the obtained abrasive surface; (3) measuring the index of the crystal surface of the surface to be ground; (4) measuring the included angle between a groove left in the surface to be processed due to processing and the ridge formed in step (1); (5) calculating according to the data measured from step (2) to step (4) so as to obtain the specific crystal orientation index or direction in the grinding direction. According to the method, the abrasive surface provided in advance and the surface to be ground form the ridge which is taken as the reference crystal orientation, in subsequent abrasive machining, characterization parameters of the specific grinding direction can be measured by a laser scanning confocal microscope only by marking initial crystal orientation on the crystal surface, and the space placing position and placing gesture of the diamond workpiece do not need to be recorded, so that the method is convenient and rapid.
Owner:HARBIN INST OF TECH
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