Preparation method of high-performance diamond reinforced Al-matrix electronic packaging composite material

A technology for electronic packaging and composite materials, which is applied in the manufacture of circuits, electrical components, semiconductor/solid-state devices, etc. It can solve the problems of uniformity of material structure, difficulty in controlling the graphitization of dense diamond, and difficulty in exerting the excellent properties of diamond, and the interface between the two phases. To achieve the effect of strong repeatability, improved density, and improved material properties

Active Publication Date: 2010-06-09
NEW MATERIAL INST OF SHANDONG ACADEMY OF SCI
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a method for preparing a high-performance diamond-strengthened Al-based electronic packaging composite material, so as to solve the problems in the traditional preparation methods, such as the difficulty in controlling the material structure uniformity, density and diamond graphitization, and poor interface bonding between the two phases. It is difficult to give full play to the excellent performance of diamond, so as to meet the current higher requirements for electronic packaging materials

Method used

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  • Preparation method of high-performance diamond reinforced Al-matrix electronic packaging composite material
  • Preparation method of high-performance diamond reinforced Al-matrix electronic packaging composite material
  • Preparation method of high-performance diamond reinforced Al-matrix electronic packaging composite material

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Experimental program
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Effect test

Embodiment 1

[0023] The particle size of single crystal diamond is 198 μm, the particle size of pure Al powder is less than 74 μm, and the volume ratio of diamond and pure Al powder is 60:40.

[0024] According to the designed raw material ratio, dry-mix single crystal diamond particles and pure Al powder in a planetary ball mill for 30 minutes at a speed of 350 r / min. After mixing evenly, spark plasma sintering (SPS) is carried out. The sintering process is as follows: the sintering temperature is 640 °C, Raise the temperature at a heating rate of 80°C / min. When the temperature reaches 400°C, apply a sintering pressure of 40MPa. After reaching a sintering temperature of 640°C, heat and hold pressure for 10 minutes. The sintering is completed. After cooling to 150°C with the furnace, the mold is removed and the material is prepared. Finish. The density of the prepared Al-diamond composite material is >91%, while the thermal conductivity reaches 227W / m·K, and the density is 2.91g / cm 3 .

Embodiment 2

[0026] The particle size of single crystal diamond is 25 μm, the pure Al powder is less than 74 μm, and the volume ratio of diamond to pure Al powder is 60:40.

[0027] According to the designed raw material ratio, dry-mix single crystal diamond particles and pure Al powder in a planetary ball mill for 30 minutes at a speed of 350 r / min. After mixing evenly, spark plasma sintering (SPS) is carried out. The sintering process is as follows: the sintering temperature is 640 °C, Raise the temperature at a heating rate of 50°C / min. When the temperature reaches 400°C, apply a sintering pressure of 40MPa. After reaching a sintering temperature of 640°C, heat and hold pressure for 10 minutes. The sintering is completed. After cooling to 150°C with the furnace, the mold is removed and the material is prepared. Finish. The density of the prepared Al-diamond composite material is >96%, while the thermal conductivity reaches 287W / m K, the thermal expansion coefficient is 7.36ppm / K, and th...

Embodiment 3

[0029] The single crystal diamond particle size is 25 μm, and the Al and Si elemental powders with a particle size of <74 μm are mixed into an elemental element mixed powder with a Si content of 1 wt.%, and the volume ratio of diamond to mixed powder is 25:75.

[0030] According to the designed raw material ratio, dry-mix single crystal diamond particles and Al and Si elemental element mixed powder in a planetary ball mill for 60 minutes at a speed of 350r / min. After mixing evenly, conduct spark plasma sintering (SPS). The sintering process is: sintering temperature 600°C, heat up at a heating rate of 50°C / min, apply a sintering pressure of 40MPa when the temperature reaches 400°C, keep the heat and pressure for 10 minutes after reaching the sintering temperature of 600°C, and complete the sintering, cool to 150°C with the furnace and take it out , the material preparation is completed. The density of the prepared Al-1wt.% Si-diamond composite material reaches 98.5%, while the...

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Abstract

The invention relates to a preparation method of a high-performance diamond reinforced Al-matrix electronic packaging composite material, belonging to the field of metal-matrix composite materials. The preparation method is characterized by comprising the following steps: adding alloy elements into a pure Al matrix to prepare elemental mixed powder or Al alloy powder; uniformly mixing the elemental mixed powder or the Al alloy powder and diamond single crystal grains according to the volume percentage ratio of 75:25-40:60; adding the mixture into a graphite mold for carrying out spark plasma sintering, wherein the mixture is added at the heating speed of 50-100 DEG C/min until the sintering temperature is 580-800 DEG C and the sintering pressure is 30-40MPa; keeping the temperature and the pressure for 5-20min; and obtaining the high-performance diamond reinforced Al-matrix electronic packaging composite material after the sintering process finishes. The alloy elements comprise B, Si, Cr, Ti, Nb, Ag, Cu and the like. The material of the invention has the characteristics that the heat conductivity reaches 430W/m.K, the heat expansion coefficient is 6.40ppm/K, the compressive strength is 331MPa, and the density is only 3.13g/cm<3>. The invention effectively solves the problem of graphitization of single crystal diamond grains in the preparation process of the material, and has simple preparation processes and high production efficiency.

Description

technical field [0001] The invention belongs to the field of metal-based composite materials, and in particular provides a preparation method of a high-performance diamond-strengthened Al-based electronic packaging composite material. Background technique [0002] With the continuous development of electronic technology, electronic products and devices tend to be miniaturized, thinner and more high-performance, which requires the continuous improvement of chip integration and power. The heat is exported in a timely and efficient manner to ensure the stability of the work. Traditional electronic packaging materials, such as Kovar alloy (thermal conductivity 17W / m K, thermal expansion coefficient 1.3ppm / K, density 8.3g / cm 3 ), W-Cu alloy (thermal conductivity 209W / m K, thermal expansion coefficient 6.5ppm / K, density 17.0g / cm 3 ) and Al-SiC composite materials (thermal conductivity 150-220W / m K, thermal expansion coefficient 6.4-12.4ppm / K, density 2.9g / cm 3 ), due to the lim...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48B22F3/14
Inventor 王西涛张洋吴建华杨滨王艳丽
Owner NEW MATERIAL INST OF SHANDONG ACADEMY OF SCI
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