A preparation method of gradient aluminum-silicon electronic packaging material

Abstract

The invention discloses a preparation method of a gradient aluminum-silicon electronic packaging material. The method comprises the steps of first obtaining aluminum-silicon alloy plates with different silicon contents by a traditional casting method; then refining each aluminum-silicon alloy plate by a rapid solidification method to obtain thin Ribbon-shaped aluminum-silicon alloy; then superimpose and ultrasonically weld thin ribbon-shaped aluminum-silicon alloys with the same silicon content to obtain bulk aluminum-silicon alloys of the required thickness; finally, after superimposing bulk aluminum-silicon alloys with different silicon contents as required, Hot-press forming, namely obtaining gradient aluminum-silicon electronic packaging material. The invention comprehensively adopts multiple advanced preparation processes of rapid solidification method, ultrasonic welding and hot pressing method, and under the premise of maintaining a relatively high silicon content, a near-completely dense two-phase uniform distribution of aluminum matrix and fine silicon phase is obtained. The gradient aluminum-silicon electronic packaging material has the advantages of simple operation, simple equipment, low porosity, excellent performance, controllable gradient gradient, green environmental protection, and mature technology.

Description

technical field [0001] The invention relates to a preparation method of a gradient aluminum-silicon electronic packaging material. Background technique [0002] As a new generation of electronic packaging materials, aluminum-silicon alloy has the advantages of low density, good thermal conductivity, low thermal expansion coefficient, high specific strength and specific stiffness, etc. application. In recent years, with the continuous deepening of research on the application of aluminum-silicon electronic packaging materials in aerospace and other fields, new technologies are needed to improve aluminum-silicon alloy packaging materials to meet various production needs, and functionally graded aluminum-silicon materials have emerged. [0003] The preparation methods of gradient aluminum-silicon electronic packaging materials that have been developed so far include: (1) laser heating synthesis method. This method has the advantages of pollution-free sintering, high efficiency...

AI Technical Summary

Problems solved by technology

This method is based on the relationship between the preparation process, structure formation and performance, and has strict requirements and is difficult to achieve.

Due to the different principles, different preparation processes, and different application ranges of the above-mentioned methods, each has its own advantages and disadvantages, so the prepared electronic packaging materials are different in size, structure and performance.