Method for determining thermal parameters of gold ribbon flexible interconnection for electrical performance of microwave components

Abstract

The invention discloses a gold strip flexible interconnection thermosensitive parameter determination method for electrical performance of microwave assembly, which comprises the steps of determininggold strip flexible interconnection geometrical parameters, physical property parameters and electromagnetic transmission parameters, and carrying out parametric representation on a gold strip flexible interconnection form; determining a gold strip flexible interconnection working condition and an environment temperature load, and establishing a gold strip flexible interconnection structure-thermal deformation analysis model; determining the thermal deformation of the flexible interconnection morphological parameters of the gold belt, and establishing a gold belt flexible interconnection structure-electromagnetic analysis model; designing an orthogonal test of the gold strip flexible interconnection form thermal deformation parameter and the electrical performance index, and calculating the thermal influence degree of the gold strip flexible interconnection form parameter; and determining a gold strip flexible interconnection form thermosensitive parameter and a form parameter thermosensitive degree. The method can guide the microwave assembly to consider the design and optimization of the application environment, and improves the development quality of microwave products.

Description

technical field [0001] The invention belongs to the technical field of microwave radio frequency circuits, in particular to a method for determining thermal parameters of gold ribbon flexible interconnections oriented to the electrical performance of microwave components, which can be used to guide the design of module interconnection and the regulation of electromagnetic transmission performance in microwave components. Background technique [0002] Modern information electronics technology is developing rapidly. As the core of hardware technology support, microwave components and microwave circuits are widely used in high-tech fields such as deep space exploration, target tracking, interconnection communication and various space applications. The development of microwave electronic equipment is gradually showing the development trend of high reliability, integration, miniaturization and high speed, which makes the breakthrough of high-quality microwave component development...

AI Technical Summary

Problems solved by technology

However, the study found that with the increase of the signal transmission frequency, the impact of the change of the interconnection shape in the microwave component on the signal transmission performance increases sharply, and even causes the function of the microwave component to fail.

When microwave electronic equipment is served in a large temperature change and extreme temperature environment, the flexible interconnection form is easily deformed by the temperature load, which in turn affects signal transmission

The above makes the thermal deformation of circuit flexible interconnection in high-frequency microwave components a key factor that affects the performance of microwave components and restricts the development of microwave electronic equipment under extreme temperature conditions.

[0004] At present, there are few theoretical and technical studies on the impact of thermal deformation of flexible interconnection on signal transmission performance in microwave circuits and microwave components.

Research in engineering mostly stays on artificial experience and a large number of interconnected thermodynamic software simulations, which result in high work costs, low efficiency and poor results

Images