Double-layer circuit board or multi-layer circuit board without manual tin filling method, printed circuit board, electronic products

Abstract

The invention provides a double-layer circuit board or multi-layer circuit board non-manual tin supplementing method, a printed circuit board and an electronic product, and solves the technical problems in the prior art that manual tin supplementing is required on a copper foil through which high current passes and the manual tin supplementing speed is low and the efficiency is low. According to the double-layer circuit board or multi-layer circuit board non-manual tin supplementing method, the top layer of the circuit board is provided with top metal requiring passage of high current, and theposition of the bottom layer of the circuit board opposite to the position of the top metal is provided with bottom metal. The method comprises the following contents: S1, a plurality of tin supplementing holes communicated with the bottom metal are arranged in the top metal area, wherein the tin supplementing holes are metallized holes; and S2, the circuit board is put in the tin-cladding equipment to make the liquid tin in the tin-cladding equipment contact with the bottom metal first and then the liquid tin rises to the top metal through the tin supplementing holes, the metal tin can adhere to the bottom metal and the top metal after the liquid tin is solidified and the liquid tin in the tin supplementing holes can fully fill in the tin supplementing holes after solidification.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for manually tinning a double-layer circuit board or a multi-layer circuit board, a printed circuit board and electronic products. Background technique [0002] When a high-power load is installed on a double-layer board or a multi-layer board, the area of ​​the copper foil at the high-power load on the circuit board is relatively large due to the excessive current required at the high-power load. Taking a double-layer circuit board as an example, there is a copper foil with a large area on the top layer of the double-layer circuit board where the high-power load is installed, and a copper foil with an area on the bottom layer of the double-layer circuit board opposite to the position of the copper foil is also provided. Larger copper foil. [0003] Under normal circumstances, after the circuit board passes through the wave soldering equipment, the amount of meta...

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a double-layer circuit board or a multi-layer circuit board free of manual tin filling method to solve the problem in the prior art that manual tin filling is required on the copper foil that needs to flow through a large current on the circuit board. The technical problem of slow speed and low efficiency

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