An anti-jamming and overload-resistant mems accelerometer

An accelerometer, sensitive structure technology, applied in the direction of measuring acceleration, speed/acceleration/shock measurement, instruments, etc., can solve the problems of application limitation, anti-interference, lack of overload resistance, etc., to improve anti-interference ability, enhance overload resistance The effect of improving capacity and stiffness

Active Publication Date: 2021-04-30
EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] At present, foreign high-performance MEMS accelerometer products are relatively mature and have been widely used in many aspects. Domestic high-performance MEMS accelerometers have been deeply researched and developed, and some companies or laboratories have prepared high-precision single-axis accelerometers. Or multi-axis accelerometer products, but they are lacking in anti-interference and overload resistance, which limits their application in high-impact environments

Method used

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  • An anti-jamming and overload-resistant mems accelerometer
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  • An anti-jamming and overload-resistant mems accelerometer

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Embodiment Construction

[0020]Combinefigure 1 versusfigure 2 As shown, the present invention provides an anti-interference-resistant overload MEMS accelerometer, including a substrate layer, induction electrode layer, a movable sensitive structure layer, a cap cap, a substrate layer, a substrate 11, a substrate 11, a substrate 11, a substrate 11, a substrate 11, a metal layer 12, a metal Copper PAD Point 13, metal copper center anchor point 15, left metal copper anchor 17 and right metal copper anchor 16, metal copper center anchor 15, left metal copper anchor 17, and The right metal copper anchor 16 is connected to the metal copper Pad point 13, respectively.

[0021]Combineimage 3 versusFigure 4 As shown, the inductive electrode layer includes an induction electrode center anchor point 22, a left sensing electrode 21, and a left-sensitive electrode 21, and the bottom portion of the left sensing electrode 23 are respectively provided with a silicon support post 24, a silicon support column 24 top and inducti...

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Abstract

The invention discloses an anti-interference and overload-resistant MEMS accelerometer, which comprises a substrate layer, a sensing electrode layer, a movable sensing structure layer and a cap which are bonded in sequence. The motion-sensitive structure layer includes a central anchor point of the first movable-sensitive structure, a first solid movable-sensitive structure and a first hollow movable-sensitive structure; the bottom of the sensing electrode is provided with a silicon support column, the top of the silicon support column is connected to the sensing electrode, and the bottom of the sensing electrode is connected with the sensing electrode. The end is connected to the substrate layer; the central anchor point of the first movable sensitive structure, the first solid movable sensitive structure and the top of the first hollow movable sensitive structure are symmetrically bonded with the central anchor point of the second movable sensitive structure and the second solid movable sensitive structure. The movable sensitive structure and the second hollow movable sensitive structure form a closed cavity between the first hollow movable sensitive structure and the second hollow movable sensitive structure; the accelerometer can reduce the influence of the external environment on the performance of the device and improve the performance of the device. reliability.

Description

Technical field[0001]The present invention relates to the field of micro-mechanical electronics technology, and in particular, an anti-interference-resistant overload MEMS accelerometer.Background technique[0002]MEMS (Micro-Electro-MeChanical Systems) is the abbreviation of the microelectromechanical system. MEMS manufacturing techniques utilize micro-nano-machining techniques, especially those with semiconductor wafer manufacturing, manufacturing various micro-nano-level mechanical structures, combined with dedicated control integration Circuit (ASIC), constizs intelligent micro-sensor, micro-performers, micro-optical devices, and other MEMS components. The MEMS components have the advantages of small size, low cost, high reliability, high intelligence, easy integration, easy integration, are widely used in aerospace, medical, industrial production, and various types of consumer products. .[0003]At present, foreign high-performance MEMS accelerometers have been more mature, and in ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01P15/125
CPCG01P15/125
Inventor 王鹏陈慧斌何凯旋黄斌王帆
Owner EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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