118results about How to "Reduce surface stress" patented technology

An arrangement and method for production of three-dimensional bodies by successive fusing together of selected areas of a powder bed, which parts correspond to successive cross sections of the three-dimensional body, which method comprises the following method steps: application of powder layers to a work table, supplying energy from a radiation gun according to an operating scheme determined for the powder layer to said selected area within the powder layer, fusing together that area of the powder layer selected according to said operating scheme for forming a cross section of said three-dimensional body, a three-dimensional body being formed by successive fusing together of successively formed cross sections from successively applied powder layers.

The invention discloses a micro-hemispherical resonant gyroscope based on borosilicate glass annealing forming and a manufacturing method thereof. A silicon wafer serves as a substrate to form a silicon substrate. A cylindrical cavity and a center supporting column in the circle center of the cavity are etched on the upper surface of the silicon wafer. The center supporting column is connected with the center of a hemispherical harmonic oscillator to form a suspended structure. Meanwhile, eight flat-plate electrodes are evenly distributed around the hemispherical harmonic oscillator and on the periphery of the cylindrical cavity of the upper surface of the silicon wafer. The eight flat-plate electrodes are composed of four drive electrodes and four detection electrodes, all the drive electrodes, the detection electrodes and the hemispherical harmonic oscillator are not in contact and have same gaps, and the drive electrodes and the detection electrodes are sequentially distributed at intervals. The glass metal blowing type micro-hemispherical resonant gyroscope manufactured through the method has stable performance and a wider application range because of the advantages of being simple in structure, low in surface stress, high in symmetry and the like.

The present disclosure relates to a laser marking device and a method thereof. The laser marking device comprises a laser system, a wafer leveling system, a first imaging system and a mobile system: the wafer leveling system carries and levels a warped wafer to be processed; the mobile system underneath properly adjusts a position of the wafer; the first imaging system detects the wafer to recognize a product category and positioning status; the laser system underneath labels laser marks on the wafer; all wafers are marked in the cyclic process.