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116results about How to "Reduce surface stress" patented technology

Micro-hemispherical resonant gyroscope based on borosilicate glass annealing forming and manufacturing method thereof

The invention discloses a micro-hemispherical resonant gyroscope based on borosilicate glass annealing forming and a manufacturing method thereof. A silicon wafer serves as a substrate to form a silicon substrate. A cylindrical cavity and a center supporting column in the circle center of the cavity are etched on the upper surface of the silicon wafer. The center supporting column is connected with the center of a hemispherical harmonic oscillator to form a suspended structure. Meanwhile, eight flat-plate electrodes are evenly distributed around the hemispherical harmonic oscillator and on the periphery of the cylindrical cavity of the upper surface of the silicon wafer. The eight flat-plate electrodes are composed of four drive electrodes and four detection electrodes, all the drive electrodes, the detection electrodes and the hemispherical harmonic oscillator are not in contact and have same gaps, and the drive electrodes and the detection electrodes are sequentially distributed at intervals. The glass metal blowing type micro-hemispherical resonant gyroscope manufactured through the method has stable performance and a wider application range because of the advantages of being simple in structure, low in surface stress, high in symmetry and the like.
Owner:NANJING UNIV OF SCI & TECH

Micro-hemispherical resonator gyroscope based on borosilicate glass annealing forming and preparing method

The invention discloses a micro-hemispherical resonator gyroscope based on borosilicate glass annealing forming and a preparing method of the micro-hemispherical resonator gyroscope. A silicon wafer is used as a substrate to form a silicon substrate, a cylindrical cavity and a center supporting pillar in the circle center of the cavity are etched on the upper surface of the silicon wafer, and the center supporting pillar is connected with the center of a hemispherical resonator to form a suspension structure. Meanwhile, eight flat plate type electrodes are evenly distributed on the periphery of the cylindrical cavity in the upper surface of the silicon wafer and around the hemispherical resonator, and the eight flat plate type electrodes are composed of the four driving electrodes and the four detection electrodes. All the driving electrodes and all the detection electrodes are not in contact with the hemispherical resonator, identical gaps exist, and the driving electrodes and the detection electrodes are arranged in sequence alternately. The prepared glass metal blowing type micro-hemispherical resonator gyroscope has the advantages of being simple in structure, low in surface stress, high in symmetry and the like, and therefore the micro-hemispherical resonator gyroscope can have stable performance and a wider application range.
Owner:NANJING UNIV OF SCI & TECH

Lithium tantalate micro-patterning method based on reactive ion etching

The invention discloses a lithium tantalate micro-patterning method based on reactive ion etching, belongs to the technical field of semiconductors, and particularly relates to lithium tantalate crystal micro-patterning, so as to solve the problem that patterns are easy to damage due to large stress among materials of each layer, and the method comprises the following steps: sequentially plating aTi metal mask and a Cr metal mask on the surface of photoresist; preparing a metal mask pattern on the surface of the lithium tantalate substrate by using a stripping method; carrying out reactive ion etching on the lithium tantalate substrate with the prepared metal mask pattern by adopting fluorine-based plasma; carrying out physical bombardment on the lithium tantalate substrate for 30 secondsto 2 minutes by adopting argon plasma so as to remove high-boiling-point non-volatile substances such as lithium fluoride and fluotantalate formed on the surface of the sample; and repeating the etching step until the micro-patterning of the lithium tantalate substrate is completed. According to the method, the micron-scale depth pattern is manufactured on the lithium tantalate substrate, the purposes that the inclination angle of the side wall of the pattern is large and the surface of the groove is smooth are achieved, a high selection ratio of a metal mask is obtained, and the etching depth is large.
Owner:UNIV OF ELECTRONICS SCI & TECH OF CHINA
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