Laser marking device and method thereof

Abstract

The present disclosure relates to a laser marking device and a method thereof. The laser marking device comprises a laser system, a wafer leveling system, a first imaging system and a mobile system: the wafer leveling system carries and levels a warped wafer to be processed; the mobile system underneath properly adjusts a position of the wafer; the first imaging system detects the wafer to recognize a product category and positioning status; the laser system underneath labels laser marks on the wafer; all wafers are marked in the cyclic process.

Description

technical field [0001] The invention relates to a wafer printing processing device and its method, in particular to a laser printing device and its method for performing laser printing operations under the condition of flattening the wafer. Background technique [0002] In recent years, smart phones have been regarded as a part of life by consumers, and various wearable devices are becoming more and more accepted. Corresponding to these consumer product trends, we can clearly understand that products tend to be miniaturized and have powerful computing capabilities change. Moreover, these consumer goods are basically electronic devices. The fastest way to make electronic devices smaller and increase their computing power is to improve the manufacturing process, and this type of theory is most famous for "Moore's Law"; among them, in the semiconductor manufacturing process One of the laser marking processes is to use a laser beam to mark the surface of the wafer for subsequen...

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Problems solved by technology

[0007] However, because the flattening device needs to be removed and then flattened again in order to rotate the wafer during processing, the surface of the wafer is pressed multiple times, thereby increasing the variation of the wafer yield; Unrecorded status, resulting in no real-time prosecution and post-mortem inspection

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