Array substrate and display panel

A technology of array substrate and bending area, which is applied in the direction of organic semiconductor devices, instruments, electrical components, etc., can solve problems such as abnormal picture, cracks, and increased stress concentration of source and drain layers, and achieve reduced risk of fracture and resistance to bending effect on ability

Active Publication Date: 2019-12-24
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But in fact, due to insufficient bending process capability, external force interference, etc., the bending angle is not ideal, and the bending angle will be deformed inward, or the bending angle will be shifted to one side, so that the source and drain in the bending area Layer stress concentration increases, resulting in cracks or fractures, and the cracks extend through the entire cross-section of the line, so the signal transmission fails, resulting in abnormal images
[0005] If the line cracks are not solved, the yield rate cannot be guaranteed, and mass production is not feasible.

Method used

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  • Array substrate and display panel

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Embodiment 1

[0044] see figure 2 , image 3 As shown, the first embodiment of the present invention provides an array substrate 100 , which defines a bending area 10 and a non-bending area 20 . The non-bending region 20 includes a stacked flexible substrate layer 1, a composite buffer layer 2, a source-drain layer 3, a planar layer 4, and a pixel definition layer 5; specifically, as figure 2 As shown, the composite buffer layer 2 is located on the flexible substrate layer 1; the source and drain layer 3 is located on the composite buffer layer 2; the planar layer 4 is located on the source and drain layer 3; The pixel definition layer 5 is located on the planar layer 4 . Wherein the bending region 10 includes a flexible substrate layer 1, a source and drain layer 3, a flat layer 4 and a pixel definition layer 5 stacked; specifically, the source and drain layer 3 is located on the flexible substrate layer 1 ; The planar layer 4 is located on the source-drain layer 3 ; the pixel definit...

Embodiment 2

[0053] see Figure 4 , Figure 5 As shown, the second embodiment of the present invention provides an array substrate 100, including all the technical features of the first embodiment of the present invention, the difference is that the array substrate 100 of the second embodiment is set in the bending area 10 There is the composite buffer layer 2 , while the array substrate 100 of the first embodiment does not have the composite buffer layer 2 in the bending region 10 . Wherein, the thickness of the composite buffer layer 2 in the bending area 10 of the array substrate 100 of the second embodiment is smaller than the thickness of the composite buffer layer 2 in the non-bending area 20 .

[0054] The thickness of the composite buffer layer 2 in the bending region 10 of the array substrate 100 proposed by the second embodiment is reduced, but compared with the prior art, the source and drain layers 3 can still move down as a whole, away from the stress The closer the balance ...

Embodiment 3

[0056] see Figure 6 As shown, in the third embodiment of the present invention, an array substrate 100 is provided, which includes all the technical features in the first embodiment of the present invention, the difference is that an organic layer 8 is provided in the third embodiment, and the organic layer 8 Formed in the non-bending region 20 and adjacent to the bending region 10, a part of the organic layer 8 covers the composite buffer layer 2 and another part is formed on the flexible substrate layer 1, and the source and drain layers 3 covering the organic layer 8. In other words, the organic layer 8 is formed at the junction of the composite buffer layer 2 and the bending region 10 . The organic layer 8 can be used as a transition to buffer the bending region 10 and the non-bending region 20 to prevent circuit breakage caused by excessive stress at the etching edge of the composite buffer layer 2 .

[0057] In this embodiment, the material of the organic layer 8 incl...

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PUM

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Abstract

The invention provides an array substrate and a display panel. The type of array substrate is composed of a bent region and a non-bent region. The non-bent region comprises a flexible substrate layer,a composite buffer layer, a source-drain layer, a flat layer and a pixel definition layer, which are stacked. The bent region comprises a flexible substrate layer, a source-drain layer, a flat layerand a pixel definition layer, which are stacked. Or the thickness of the composite buffer layer located in the bent region is smaller than the thickness of the composite buffer layer located in the non-bent region. The display panel comprises the array substrate. According to the invention, the distance between a metal trace and the substrate is reduced, so that the source-drain layers approachesor even reaches a stress balance line; the stress received by the metal trace can be reduced, and even the metal trace is substantially free from the own stress; if the metal trace is not stressed, the fracture risk thereof is reduced; and the bending resistance of a screen is improved.

Description

technical field [0001] The present invention relates to the display field, in particular to an array substrate and a display panel. Background technique [0002] With the vigorous rise of the organic light-emitting diode (OLED) business, foldable products are booming, and among them, bending technology has become a bottleneck restricting the further development of products. [0003] like figure 1 as shown, figure 1 It is a structural schematic diagram of an existing array substrate after being bent. The array substrate 90 includes a bending area 91 and a non-bending area 92 , and the array substrate 90 includes a flexible substrate layer 901 , a composite buffer layer 902 , a source-drain layer 903 , a flat layer 904 and a pixel definition layer 905 . Usually, after the bending area 91 is bent, the thickness of the array substrate 90 is generally 12-20um, and the thickness of the metal wiring (ie, the source and drain layer 903) located in the bending area 91 is 0.6-1um, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32G09F9/33
CPCG09F9/33H10K59/131H10K2102/311
Inventor 周阳
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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