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First level package for pressure sensor module

A pressure sensor and pressure technology, applied in fluid pressure measurement by changing ohmic resistance, measuring fluid pressure, testing of machine/structural components, etc., can solve problems such as susceptibility to corrosion

Inactive Publication Date: 2019-12-31
SENSATA TECHNOLOGIES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, moderate exposure testing of standard primary packaging shows susceptibility to corrosion, especially in exhaust environments

Method used

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  • First level package for pressure sensor module
  • First level package for pressure sensor module
  • First level package for pressure sensor module

Examples

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Embodiment Construction

[0021] In the following description, the same components are given the same reference numerals regardless of whether they are shown in different examples. In order to illustrate the examples in a clear and concise manner, the drawings are not necessarily to scale and certain features may be shown in somewhat schematic form. Features described and / or illustrated with respect to one example may be used in the same or similar manner in one or more other examples and / or in combination with or instead of features of other examples.

[0022] As used in the specification and claims, for the purposes of describing and defining the present invention, the terms "about" and "approximately" are used to denote inherent limitations attributable to any quantitative comparison, numerical value, measurement or other expression. uncertainty. The terms "about" and "approximately" are also used herein to denote the degree by which a quantitative expression may vary from a stated basis without re...

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Abstract

The disclosure relates to a first level package for a pressure sensor module. The first level package for a pressure sensor module includes: a lead frame having electrical components; a substrate coupled to the lead frame; a sensing element mounted to the substrate and in electrical communication with the lead frame, the sensing element configured to generate a signal in response to a pressure applied thereto; and an overmold encapsulating the lead frame and at least a portion of the substrate to form a first cavity surrounding the sensing element on the substrate. The present disclosure alsorelates to a method for manufacturing a first level package system for a pressure sensor module.

Description

technical field [0001] The present disclosure relates to pressure sensors, and more particularly, the present disclosure relates to primary packaging of pressure sensor modules for internal combustion engines. Background technique [0002] In the automotive industry, pressure sensors are often incorporated into fuel systems, braking systems, vehicle stability systems, etc. For example, the exhaust systems of internal combustion engines in passenger cars and commercial vehicles often require the presence of particulate filters (eg soot filters) to meet industry requirements. However, when the filter becomes clogged, the filter needs to be replaced periodically. In order to trigger this regeneration process, a sensor for measuring the pressure drop across the filter is usually used. [0003] In some applications, pressure drop measurement can be achieved with MEMS-based pressure sensing elements. A protective gel is typically placed around the sensing element to provide mec...

Claims

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Application Information

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IPC IPC(8): G01L19/14
CPCG01L19/14G01L9/0052G01L19/0038G01L19/141G01L19/147G01M15/106B81B7/0032B81B2201/0264G01L7/182G01L9/0041G01L9/008G01L7/08G01L19/06G01L9/04
Inventor F·G·D·莫辛克A·C·赫伦
Owner SENSATA TECHNOLOGIES INC