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A wafer etching equipment

A technology for etching equipment and wafers, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve the problems of etching liquid flow, different widths at different heights of etching positions, and difficulty in controlling, so as to achieve narrowing of differences The difference in height, the probability of reducing flow, and the effect of avoiding flow around

Active Publication Date: 2021-09-21
深圳市中科光芯半导体科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Because the etchant stays on the wafer during etching, the etchant will flow around, which is difficult to control. The longer the stay time, the more the etchant flows, which will lead to different widths at different heights of the etched position, resulting in difference

Method used

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  • A wafer etching equipment
  • A wafer etching equipment
  • A wafer etching equipment

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Embodiment Construction

[0025] Next, the technical solutions in the embodiments of the present invention will be apparent from the embodiment of the present invention, and it is clearly described, and it is understood that the described embodiments are merely embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, there are all other embodiments obtained without making creative labor without making creative labor premises.

[0026] See Figure 1-4 The present invention provides a wafer etching apparatus for a wafer etching apparatus: its structure includes a moving wheel 1, a etching box 2, a cover 3, a display screen 4, a control tank 5, and a moving wheel at the bottom of the etching box 2. The top of the organic box 2 is provided with a cover 3, the control box 5, provided on the side of the cover 3 and is attached to the top of the etching case 2, the surface of the control box 5 is mounted 4, the etching The box 2 is provided with a stage 6...

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Abstract

The invention discloses a wafer etching equipment, which comprises a moving wheel, an etching box, a box cover, a display screen and a control box. The bottom of the etching box is equipped with a moving wheel, and the top of the etching box is provided with a box cover. The box is set on the side of the box cover and connected to the top of the etching box. A display screen is installed on the surface of the control box. The etching box is equipped with a stage, a first fixture, a second fixture, an injector, a cylinder, a Y-axis guide rail, Shaft guide rail, the stage is connected to the bottom of the box cover, the first fixture and the second fixture are respectively installed on both sides of the bottom of the stage, the injector is set under the stage, the bottom of the injector is connected with the cylinder, and the cylinder is installed on On the Y-axis guide rail, the beneficial effect of the present invention is: through a series of rapid operations of spraying and sucking back, the residence time of the etching solution can be reduced, the flow of the etching solution can be avoided, and the injection from the bottom to the top can reduce the flow of the etching solution to the surroundings. The probability will allow the etching solution to flow downward, so the difference in height of the etching position can be reduced.

Description

Technical field [0001] The present invention relates to the field of wafers, in particular to a wafer etching apparatus. Background technique [0002] Wafer is a basic raw material for manufacturing a semiconductor device, applied to a film circuit, a printed circuit, and other fine graphics processing. [0003] Since the etching liquid is stopped on the wafer during etching, the etching liquid will flow at all, it is difficult to control, the longer the liquid flow, the loose fluid flow, resulting in different heights of the etching difference, production difference. Inventive content [0004] The main object of the present invention is to overcome the shortcomings of the prior art, providing a wafer etching apparatus. [0005] The present invention adopts the following technical solution: a wafer etching apparatus including a moving wheel, a etchator, a cover, a display screen, a control box, and a moving wheel at the bottom of the etch box, the moment There is a lid on the to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/6708
Inventor 汪洪安
Owner 深圳市中科光芯半导体科技有限公司
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