Circuit board assembly, backplane interconnection system and electronic device

Abstract

The embodiment of the invention provides a circuit board assembly, a backplane interconnection system and an electronic device, and relates to the technical field of electronic products. The circuit board assembly comprises a bracket and a circuit board. The circuit board is provided with a fixed part and a free part. The fixed part is connected with the bracket. The free part is suspended. The surface where the free part and the fixed part coexist is a first plane. The free part has a swing amount in the first direction. The first direction is perpendicular to the first plane. The circuit board is in insertion joint with a front sub-circuit board. A first connector is in insertion joint with a first plug end on the front sub-circuit board. The first connector is in insertion joint with the first plug end due to the swing amount.

Description

technical field [0001] The present application relates to the technical field of electronic products, in particular to a circuit board assembly, a backplane interconnection system and electronic equipment. Background technique [0002] As the signal transmission efficiency of electronic equipment becomes higher and higher, the circuit system requires a more direct and efficient interconnection method to transmit high-speed signals. In order to meet this requirement, in the fields of IT and CT, direct connection methods between sub-cards and motherboards are emerging. Refer to figure 1 , figure 2 and image 3 , the circuit system includes a motherboard 001, a rear terminal card 005 and a front terminal card 004, the motherboard 001 has a front terminal card connector 002 and a rear terminal card connector 003, and the front terminal card 004 has a The first port 006 plugged into the front terminal card connector 002, the rear terminal card 005 has a second port 007 plugge...

AI Technical Summary

Problems solved by technology

However, the technical problem of this solution is that the ability of metal dome 008 to absorb tolerance is limited, generally below ±0.5mm, and sometimes it is still impossible to make the front terminal card 004 and motherboard 001 mated. If it is necessary to increase the ability of metal dome 008 to absorb tolerance , the size of the metal shrapnel 008 needs to be increased. Although the ability of the metal shrapnel 008 to absorb tolerances is improved, it is still limited, and the size of the entire front terminal card 004 in the height direction will become larger due to the increase of the metal shrapnel 008. Further increase the space occupied by the front terminal card 004 and reduce the layout density of the front terminal card 004

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