Wafer cleaning device
A technology for cleaning devices and wafers, applied in electrical components, circuits, semiconductor/solid-state device manufacturing, etc., can solve the problems of cumbersome wafer cleaning steps, cumbersome cleaning steps, low cleaning efficiency, etc., and save the time of turning and transferring. , Enhance the cleaning effect, improve the cleaning efficiency
Active Publication Date: 2022-07-29
YANGTZE MEMORY TECH CO LTD
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Problems solved by technology
[0004] In the prior art, the wafer cleaning steps are very cumbersome. It is necessary to take out the wafer from the front opening unified pod (FOUP), turn the wafer over so that the back of the wafer faces upward, and put it into the first cleaning chamber. Clean the back of the wafer in the second cleaning chamber; then, take the wafer out, turn it over again so that the front of the wafer is facing up, put it into the second cleaning chamber, and clean the front of the wafer
Due to the cumbersome cleaning steps, the cleaning efficiency is very low, and when the wafer is turned over, it is easy to misuse, which makes the orientation of the wafer wrong, which affects the progress of the subsequent process
[0005] In addition, since the pollutants on the back of the wafer may adhere to the wafer, it is not easy to completely remove the pollutants, which will affect the focus of the subsequent photolithography process
Method used
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[0023] The present invention will be described in more detail below with reference to the accompanying drawings. In the various figures, like elements are designated by like reference numerals. For the sake of clarity, various parts in the figures have not been drawn to scale. Additionally, some well-known parts may not be shown in the drawings.
[0024] Numerous specific details of the invention are described below, such as the construction of components, materials, dimensions, processing and techniques, in order to provide a clearer understanding of the invention. However, as can be understood by one skilled in the art, the present invention may be practiced without these specific details.
[0025] It will be understood that, in describing the structure of a component, when a layer or region is referred to as being "on" or "over" another layer or region, it can be directly on the other layer or region, or Other layers or regions are also included between it and another la...
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The application discloses a wafer cleaning device, the wafer cleaning device includes: a wafer placement mechanism for clamping the edge of the wafer and driving the wafer to rotate; a first nozzle is located on one side of the wafer placement mechanism, It is used to spray the cleaning agent upward to the backside of the wafer; and the cleaning brush and guide rail are located on one side of the wafer placement mechanism, the cleaning brush is movably connected with the guide rail, and the cleaning brush can move relative to the guide rail to clean the backside of the wafer. The backside of the wafer is cleaned by the wafer cleaning device, so that the contaminants on the backside of the wafer can be simultaneously affected by the shear force of the cleaning brush and its own gravity, thereby being more easily removed from the backside of the wafer and enhancing the cleaning effect.
Description
technical field [0001] The present invention relates to the field of semiconductor technology, and more particularly, to a wafer cleaning device. Background technique [0002] The improvement of the storage density of memory devices is closely related to the advancement of the semiconductor manufacturing process. As the feature sizes of semiconductor manufacturing processes are getting smaller and smaller, the storage density of memory devices is getting higher and higher. In order to further increase the storage density, three-dimensionally structured storage devices (ie, 3D storage devices) have been developed. 3D memory devices include multiple memory cells stacked in a vertical direction, which can exponentially increase the integration level on a wafer per unit area, and can reduce costs. [0003] The size of 3D memory devices is getting smaller and smaller, and the requirements for the accuracy of lithography steps are getting higher and higher. In order to ensure th...
Claims
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IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/67046H01L21/67051H01L21/0209
Inventor 朱焜顾立勋夏余平
Owner YANGTZE MEMORY TECH CO LTD