Smart tape and logistics system using the same

A logistics system and tape technology, which is applied to record carriers, adhesives, and collaborative devices used in machines, can solve problems such as time-consuming and laborious, and achieve the effect of preventing tampering.

Pending Publication Date: 2020-01-24
WILLSUN INT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to clarify the responsibility for the damage to the goods, it is necessary to check the shock-sensing label all the time to confirm whether the shock-sensing label is broken, which is time-consuming and labor-intensive.

Method used

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  • Smart tape and logistics system using the same
  • Smart tape and logistics system using the same
  • Smart tape and logistics system using the same

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Embodiment Construction

[0057] In order to fully understand the purpose, features and effects of the present invention, the present invention will be described in detail by means of the following specific embodiments and accompanying drawings, as follows. Please note here that the terms "upper" and "lower" in the embodiments are only used to express relative positions. For example, object A is located below object B, and object C is located above object B, but in actual use, it may be used upside down, so that object A is located above object B, and object C is located below object B.

[0058] An embodiment of the present invention provides a smart adhesive tape, which is thin and easy to tear and stick. The smart adhesive tape has a chip mounted on a flexible substrate, a shielding layer is provided above the chip, and an adhesive layer is provided below or outside the chip. Through the adhesive layer, the smart tape can be attached to goods or packaging boxes (or packaging bags). The smart adhesi...

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PUM

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Abstract

The invention discloses a smart tape, wherein the smart tape has a flexible substrate, chip, conductive glue, shielding layer and back glue layer. The chip is disposed above or below the flexible substrate. The conductive glue is electrically connected to the chip through the flexible substrate and has a specific pattern, so as to function as a sensing unit for sensing whether the smart tape has been peeled off. The shielding layer is disposed above the chip to protect the chip and prevent oxidation of the conductive glue. The back glue layer is disposed below the flexible substrate. The smarttape enables a user to know situation of cargoes, and when the cargo is damaged, responsibility can be quickly cleared up.

Description

technical field [0001] The invention relates to an intelligent adhesive tape and a logistics system using the intelligent adhesive tape, in particular to an intelligent adhesive tape that can be easily torn and pasted on articles and can sense the condition of goods transported and a logistics system using the intelligent adhesive tape. Background technique [0002] At present, the development of radio frequency (radio frequency, RF) sensing technology has been perfected, and the radio frequency sensing technology is more widely used in various fields and places. For example, an electronic tag includes an antenna, a chip and an adhesive tape, wherein the antenna and the chip are embedded in the adhesive tape, so as to communicate with an external reading device through the chip and the antenna, so as to realize the recipient identification function and prevent the goods from being counterfeited. Take it or take it privately. However, the electronic tag does not have a senso...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077G06K17/00C09J7/29G06F21/64
CPCG06K19/0776G06K19/07722G06K17/00C09J7/29G06F21/64C09J2479/086C09J2467/006H01L23/3121H01L23/573H01L23/4985G06K19/07798G06K19/0775G06K19/07749H01L2224/32225H01L24/32H01L23/66H01L2223/6677G06K19/0723H01L23/564H01L23/49838
Inventor 庄承鑫
Owner WILLSUN INT CO LTD
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