Copper powder for layer molding, and layer molded product thereof
A technology of copper powder and products, which is applied in the field of copper powder and laminated products to achieve the effect of high conductivity
Active Publication Date: 2020-01-31
FUKUKA METAL FOIL & POWDER CO LTD +1
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Problems solved by technology
However, pure copper has not been put into practical use because it is impossible to form a laminated formed product having a high density of 98.5% or more at which a coolant such as gas or water does not leak
Method used
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Examples
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Embodiment Construction
[0081] Examples 1 to 5 and Comparative Example 1 according to the present exemplary embodiment will be described below.
[0082] >
[0083] By gas atomization using gas such as helium, argon, and nitrogen as the gas atomization method, copper powder to which phosphorus element is added is produced by controlling pulverization by adjusting the pressure and flow rate of each gas.
[0084] By changing the content of phosphorus element in the pure copper after adding to 0.240 (embodiment 1), 0.170 (embodiment 2), 0.080 (embodiment 3), 0.030 (embodiment 4), 0.015 (embodiment 5) and 0.002 (comparative example 1) to produce copper powder.
[0085] >
[0086] An image of the produced copper powder was taken by using a SEM (Scanning Electron Microscope) (SEM×500). Figures 2A to 2E SEM images of the copper powders of Examples 1 to 5 are shown. image 3 A SEM image of the copper powder of Comparative Example 1 is shown.
[0087] The content of the phosphorus element in the copper p...
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Abstract
The present invention can obtain a layer molded product having high density and high electrical conductivity through development of a copper powder for layer molding to which phosphorus (P) is added so as to suitably reduce the electrical conductivity of copper and thereby obtain a high-density layer molded product using a layer molding method in which a fiber laser is used as a heat source. The present invention is a copper powder for layer molding, in which phosphorus element is added to pure copper. The copper powder for layer molding preferably contains 0.01 wt% or more of phosphorus element. In addition, the copper powder for layer molding preferably contains 0.04 wt% or more of phosphorus element. In addition, the copper powder for layer molding preferably contains 0.30 wt% or less of phosphorus element. In addition, the copper powder for layer molding preferably contains 0.24 wt% or less of phosphorus element. In addition, it is preferable for elements other than phosphorus element not to be added to the copper powder for layer molding.
Description
technical field [0001] The present invention relates to a copper powder for lamination molding and a lamination molding product. Background technique [0002] Laser beam lamination uses a fiber laser as a heat source and forms arbitrary shapes by melting and solidifying a powder bed on which metal powder is spread. There are examples in which high-density molded products can be obtained by using iron alloys (referred to as Fe alloys) and nickel alloys (referred to as Ni alloys). However, pure copper is an element with high electrical conductivity and high thermal conductivity, and it is expected to form electrically conductive products and thermally conductive parts with complex shapes by lamination forming using laser beams. However, pure copper has not been put into practical use because it is impossible to form a laminated formed product having a high density of 98.5% or more at which a coolant such as gas or water does not leak. [0003] In the above technical field, a...
Claims
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IPC IPC(8): B22F1/00B22F3/105B22F3/16B22F1/052
CPCB33Y70/00B33Y80/00C22C1/0425Y02P10/25B22F1/052B22F10/10B22F10/28B22F12/41B22F1/00B33Y10/00B33Y30/00B29C64/153B22F3/16B22F2999/00
Inventor 杉谷雄史西泽嘉人丸山刚史大久保浩明
Owner FUKUKA METAL FOIL & POWDER CO LTD