A kind of LED display screen and preparation method thereof

Abstract

The invention discloses a method for preparing an LED display screen, which includes: presetting a temporary fixture composed of a first substrate with several placement grooves and a cover plate, and passing the R, G and B three-color LEDs through the entrances of the placement grooves Alternately placed in each placement slot; use the side cover to attach the temporary fixture, and use the LED substrate to replace the cover plate and attach each LED to the LED substrate; remove the first substrate and the side cover And sealing the LED substrate, and connecting the circuit board with the LED substrate, so as to obtain the LED display screen. In the present invention, the LED is placed in the placement groove of the temporary fixture, the cover plate of the temporary fixture is replaced by the LED substrate, and the LED substrate is pressed together with the LED, so that the LED and the LED substrate can be quickly connected , so that the production efficiency of the LED screen can be greatly improved.

Description

technical field [0001] The invention relates to the field of display screens, in particular to an LED display screen and a preparation method thereof. Background technique [0002] With the continuous development of LED displays, MINI LED or MICRO LED displays have attracted people's attention for their high brightness, high contrast, ultra-high resolution and color saturation. The MINI LED or MICRO LED display is composed of a large number of LED (R, G, B) arrays, and each LED can be driven independently, so that the MINI LED or MICRO LED display also has the advantages of power saving and fast response. However, at present, during the production process of MINI LED or MICRO LED display screens, the LEDs need to be clamped and placed on the PCB one by one, and the LED soldering pins are precisely aligned with the PCB pads. High precision is required. On the other hand, when a large number of LEDs are transferred, it takes a lot of time to manually carry out bonding alignme...

AI Technical Summary

Problems solved by technology

However, at present, during the production process of MINI LED or MICRO LED display screens, the LEDs need to be clamped and placed on the PCB one by one, and the LED soldering pins are precisely aligned with the PCB pads. There are high requirements for precision. On the other hand, when a large number of LEDs are transferred, it takes a lot of time to manually perform bonding and alignment, which makes the production efficiency of MINI LED or MICRO LED displays low.

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