A kind of LED display screen and preparation method thereof

A technology of LED display screen and LED substrate, applied in the field of display screen, can solve the problems of low production efficiency and large division of MINILED or MICROLED display screen, and achieve the effect of fast connection and great production efficiency

Active Publication Date: 2021-09-28
SHENZHEN TCL NEW-TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, during the production process of MINI LED or MICRO LED display screens, the LEDs need to be clamped and placed on the PCB one by one, and the LED soldering pins are precisely aligned with the PCB pads. There are high requirements for precision. On the other hand, when a large number of LEDs are transferred, it takes a lot of time to manually perform bonding and alignment, which makes the production efficiency of MINI LED or MICRO LED displays low.

Method used

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  • A kind of LED display screen and preparation method thereof
  • A kind of LED display screen and preparation method thereof
  • A kind of LED display screen and preparation method thereof

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Embodiment Construction

[0037] The present invention provides an LED display screen and a preparation method thereof. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0038] This embodiment provides a kind of preparation method of LED display screen, such as figure 1 Said, said method comprises the steps of:

[0039] S10. Preset a temporary jig consisting of a first substrate with several placement slots and a cover plate, and place R, G, and B tricolor LEDs alternately in each placement slot through the entrances of each placement slot, wherein the LEDs located in the same placement slot The LEDs in the slots are of the same color;

[0040] S20, using a side cover to attach the temporary fixture, and replacing the cover with ...

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Abstract

The invention discloses a method for preparing an LED display screen, which includes: presetting a temporary fixture composed of a first substrate with several placement grooves and a cover plate, and passing the R, G and B three-color LEDs through the entrances of the placement grooves Alternately placed in each placement slot; use the side cover to attach the temporary fixture, and use the LED substrate to replace the cover plate and attach each LED to the LED substrate; remove the first substrate and the side cover And sealing the LED substrate, and connecting the circuit board with the LED substrate, so as to obtain the LED display screen. In the present invention, the LED is placed in the placement groove of the temporary fixture, the cover plate of the temporary fixture is replaced by the LED substrate, and the LED substrate is pressed together with the LED, so that the LED and the LED substrate can be quickly connected , so that the production efficiency of the LED screen can be greatly improved.

Description

technical field [0001] The invention relates to the field of display screens, in particular to an LED display screen and a preparation method thereof. Background technique [0002] With the continuous development of LED displays, MINI LED or MICRO LED displays have attracted people's attention for their high brightness, high contrast, ultra-high resolution and color saturation. The MINI LED or MICRO LED display is composed of a large number of LED (R, G, B) arrays, and each LED can be driven independently, so that the MINI LED or MICRO LED display also has the advantages of power saving and fast response. However, at present, during the production process of MINI LED or MICRO LED display screens, the LEDs need to be clamped and placed on the PCB one by one, and the LED soldering pins are precisely aligned with the PCB pads. High precision is required. On the other hand, when a large number of LEDs are transferred, it takes a lot of time to manually carry out bonding alignme...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G09F9/33
CPCG09F9/33H01L25/0753H01L33/62H01L2933/0066H01L33/0095H01L27/156H01L33/005H01L33/486
Inventor 林健源罗崇辉
Owner SHENZHEN TCL NEW-TECH CO LTD
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