Full-process tracing method for FPC with black cover film
A cover film, black technology, applied in the direction of printed circuit manufacturing, printed circuit secondary processing, electrical components, etc., can solve the problems that FPC cannot be realized, the process cannot be traced, and the production method of the whole process traceability of production information is not perfect.
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[0023] In order to further explain the technical solution of the present invention, the present invention will be described in detail below through specific examples.
[0024] like Figure 1 to Figure 5 As shown, the present invention provides a method for traceability of the whole process of FPC with a black cover film, and its technological process is as follows:
[0025] Step 1: The black cover film 2 opens a window in the area corresponding to the two-dimensional code 11 of the FPC board 1 to make a two-dimensional code window 22, such as figure 2 shown;
[0026] Step 2: The black cover film 2 is pre-laminated on the FPC board 1 that has been laser-drilled with a two-dimensional code 11 on the edge of the board, such as image 3 shown;
[0027] Step 3: The black cover film 2 is thermocompressed on the FPC board 1;
[0028] Step 4: The light-transmitting cover film 3 is pre-laminated on the two-dimensional code window 22 on the edge of the FPC board 1;
[0029] Step 5...
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